2022 | OriginalPaper | Chapter
Computational Prediction of SiCf/SiC Stiffness and Thermal Residual Stress by 3D Micro-scale FEA Methods
Authors : Fei Li, Bin Liu, Nongyue Gao, Xiaoping Zhong, Min Chang, Laifei Cheng
Published in: Proceedings of the 5th China Aeronautical Science and Technology Conference
Publisher: Springer Singapore
Activate our intelligent search to find suitable subject content or patents.
Select sections of text to find matching patents with Artificial Intelligence. powered by
Select sections of text to find additional relevant content using AI-assisted search. powered by