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Journal of Materials Science: Materials in Electronics
Published in: Journal of Materials Science: Materials in Electronics 3/2014

01-03-2014

Corrosion behavior of Sn–3.0Ag–0.5Cu solder under high-temperature and high-humidity condition

Authors: Mingna Wang, Jianqiu Wang, Wei Ke

Published in: Journal of Materials Science: Materials in Electronics | Issue 3/2014

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Abstract

The aim of this study is to evaluate the corrosion behavior of Sn–3.0Ag–0.5Cu (SAC305) solder alloy under high-temperature and high-humidity condition. The corrosion of SAC305 alloy was attributed to the oxidation of Sn, which formed SnO2 and SnO, and SnO2 existed on the outer layer of the oxide film. After a period exposure, a stable and dense protective oxide film formed on the specimen surfaces, and the specimen which exposed at 75 °C had the thickset oxide film.
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Metadata
Title
Corrosion behavior of Sn–3.0Ag–0.5Cu solder under high-temperature and high-humidity condition
Authors
Mingna Wang
Jianqiu Wang
Wei Ke
Publication date
01-03-2014
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 3/2014
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-014-1714-8

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