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International Journal on Interactive Design and Manufacturing (IJIDeM)

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04-08-2022 | Original Paper

Design and analysis of ECAP Processing for Al6061 Alloy: a microstructure and mechanical property study

Authors: Ankita Awasthi, Kuldeep K Saxena, R. K. Dwivedi, Dharam Buddhi, Kahtan A. Mohammed

Published in: International Journal on Interactive Design and Manufacturing (IJIDeM) | Issue 5/2023

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Abstract

In this study, equal channel angular pressing (ECAP) method is used to obtain fine grain microstructure in Al 6061 alloy at room and elevate temperatures. The billet samples are allowed to pass through die channel. Die design parameters such as die angle, corner angle, passing route, number of passes, plunger speed are taken into account in order to obtain the recorded grain refinement. It is seen that grain structure changes, the mechanical properties such as hardness, tensile strength of material also changes. A metallurgical optical microscope is used to capture the microstructure pattern. The ECAP technique performed at different processing conditions such as one pass, three pass and six pass at room temperature and elevated temperature. The route B_C is used to pass the sample through the die because B_C route provide elongated and equiaxed grains. The experimentally recorded tensile strength of one pass, three pass and six pass ECAP processed are 233 MPa, 184 MPa and 215 MPa respectively. The results reveal that there is a remarkable percentage change observed in tensile strength of processed samples before and after ECAP process are 121.9%, 75.2% and 104.7% respectively. Likewise, micro hardness value found to be increase as a function of passes on ECAP process.

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Title: Design and analysis of ECAP Processing for Al6061 Alloy: a microstructure and mechanical property study
Authors: Ankita Awasthi
Kuldeep K Saxena
R. K. Dwivedi
Dharam Buddhi
Kahtan A. Mohammed
Publication date: 04-08-2022
Publisher: Springer Paris
Published in: International Journal on Interactive Design and Manufacturing (IJIDeM) / Issue 5/2023
Print ISSN: 1955-2513
Electronic ISSN: 1955-2505
DOI: https://doi.org/10.1007/s12008-022-00990-2

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