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Microsystem Technologies
Published in: Microsystem Technologies 1/2019

02-05-2018 | Technical Paper

Design of a packaging-friendly double-topology RF MEMS switch for space applications

Authors: Evgeny A. Savin, Roman V. Kirtaev, Andrey A. Zhukov, Pavel I. Didyk

Published in: Microsystem Technologies | Issue 1/2019

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Abstract

This article presents the results of the research, design and a series of manufacturing steps of an RF-MEMS switch to be used in space communication systems. Design and measurement results are discussed. Double-topology geometry for anodic bonding is presented.
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Literature
Alagashev GK, Savin EA (2017) Development of RF MEMS cantilever beam to maximize capacitance in an activated state. Int J Appl Eng Res 12(15):5169–5172
De Pasquale G, Veijola T, Somà A (2009) Modelling and validation of air damping in perforated gold and silicon MEMS plates. J Micromech Microeng 20(1):1–12
Giacomozzi F et al (2015) RF-MEMS packaging by using quartz caps and epoxy polymers. Microsyst Technol 21(9):1941–1948CrossRef
Huang S, Zhang X (2007) Gradient residual stress induced elastic deformation of multilayer MEMS structures. Sens Actuators A 134(1):177–185CrossRef
Iannacci J (2003) Practical guide to RF-MEMS. Wiley-VCH, Singapore
Kingsley N, Ponchak GE, Papapolymerou J (2008) Reconfigurable RF MEMS phased array antenna integrated within a liquid crystal polymer (LCP) system-on-package. IEEE Trans Antennas Propag 56(1):108–118CrossRef
Quaranta F et al (2018) Wafer-level micropackaging in thin film technology for RF MEMS applications. Microsyst Technol 24(1):575–585CrossRef
Sano K et al (2006) RF MEMS switch up to 20 GHz with wafer level packaging. In: Transaction of the society of instrument and control engineers, vol E-S-1(1) 11/15
Seki T (2004) Recent progress in packaging of RF MEMS. In: Compound semiconductor integrated circuit symposium proceedings
Vaha-Haikkila T et al (2007) RF MEMS impedance tuners for 6–24 GHz applications. Int J RF Microw Comput Aided Eng 17(3):265–278CrossRef
Zhukov AA et al (2006) The way of manufacturing via-holes in silicon substrates. Patent RF RU 2 629 926 C1MПК H01L 21/768 from 04.09.17 (in Russian)
Zhukov AA et al (2017) Profile, morphology and elemental composition of the via micro-holes surfaces in silicon wafers. In: Surface, X-ray, synchrotron and neutron research 10, pp 38–43 (in Russian)
Zhukov AA, Grebenyuk EI, Sagitov GM (2017) Diffraction control method of the via micro-holes in the precise devises. Devices 5:29–36 (in Russian)
Metadata
Title
Design of a packaging-friendly double-topology RF MEMS switch for space applications
Authors
Evgeny A. Savin
Roman V. Kirtaev
Andrey A. Zhukov
Pavel I. Didyk
Publication date
02-05-2018
Publisher
Springer Berlin Heidelberg
Published in
Microsystem Technologies / Issue 1/2019
Print ISSN: 0946-7076
Electronic ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-018-3929-8

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