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10. Design von Halbleiterfertigungsanlagen

  • 2023
  • OriginalPaper
  • Chapter
Published in:
Authors
Hartmut Frey
Engelbert Westkämper
Bernd Hintze
Published in
Handbuch energiesparende Halbleiterbauelemente – Hochintegrierte Chips
Publisher
Springer Fachmedien Wiesbaden

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Zusammenfassung

Je feiner die Strukturen auf Chips werden, desto bedeutsamer wird die Ausbeute der Chips in Abhängigkeit von der Defektdichte. Quellen für Defekte können sein: Verunreinigungen in Chemikalien, Pinholes in abgeschiedenen Schichten, die Haftprobleme verursachen können. Die meisten Defekte entstehen, wenn kleine Partikel aus der Umgebung auf das Halbleitersubstrat gelangen.

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previous chapter Mess- und Analysemethoden
next chapter Ökologie in der Halbleiterfertigung
Title
Design von Halbleiterfertigungsanlagen
Authors
Hartmut Frey
Engelbert Westkämper
Bernd Hintze
Copyright Year
2023
Book
Handbuch energiesparende Halbleiterbauelemente – Hochintegrierte Chips

Print ISBN: 978-3-658-39345-8

Electronic ISBN: 978-3-658-39346-5

Copyright Year: 2023

DOI
https://doi.org/10.1007/978-3-658-39346-5_10
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    Image Credits
    in-adhesives, MKVS, Ecoclean/© Ecoclean, Hellmich GmbH/© Hellmich GmbH, Krahn Ceramics/© Krahn Ceramics, Kisling AG/© Kisling AG, ECHTERHAGE HOLDING GMBH&CO.KG - VSE, Schenker Hydraulik AG/© Schenker Hydraulik AG