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01-09-2012 | Originals Originalarbeiten | Issue 5/2012

European Journal of Wood and Wood Products 5/2012

Dielectric analysis as curing control for aminoplast resins—correlation with DMA

Journal:
European Journal of Wood and Wood Products > Issue 5/2012
Authors:
Claudia Pretschuh, Uwe Müller, Günter Wuzella, Florian Dorner, René Eckmann

Abstract

Dielectric analysis (DEA) is a well-known method used for the monitoring of curing processes in non-aqueous radical or polyadditive systems. Tests on polycondensating binders used in wood-working industry show that the method is also suited for the curing characterization of aminoplast materials. As an evaluation of the test method, a correlation with dynamic mechanical analysis (DMA)—a conventional method for curing characterization—was carried out using simultaneous measurements. For thermally cross-linked urea-formaldehyde (UF) resins, ion viscosity measured by DEA is synchronously increasing with the storage modulus determined by DMA. Significantly, deceleration effects are detectable upon using latent ionic curing agents. Model free kinetics allows the calculation of isothermal values from dynamic measurements of logarithmic ion viscosity. The correlation tests provide a basis for DEA to be established as an in situ curing characterization method for aminoplast resin systems.

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