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2016 | OriginalPaper | Chapter

Dynamic Response Characteristics of the PCB Under Thermo-Acoustic Load

Authors : Cunxian Cao, Jiangfeng Huang, Daoqing Qu, Miao Zhang

Published in: Computer Engineering and Technology

Publisher: Springer Singapore

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Abstract

The temperature of thermal buckling of the PCB is very low. The dynamic response characteristics of the PCB are very different from pre-buckling and post-buckling. The snap-through motion between multiple post buckled equilibrium positions introduces high level of alternating stress which reduces the fatigue life of the structures. The vibration equation for the PCB under thermo-acoustic load is derived in this paper. Thermal post buckling equilibrium Path is solved using the finite element method. The affection of the thermo-acoustic load on the dynamic response is analyzed with the study of the difference of dynamic response characteristics of the PCB from pre-buckling and post-buckling. The conclusions provide a reference for the calculation of stochastic dynamics with the consideration of the thermal buckling and the prediction of the PCB fatigue life under thermo-acoustic load. Furthermore, it lays a foundation for the structural optimization, which aims to increase the fatigue life of the PCB.

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previous chapter A Novel Separated Pre-discharging Sense Amplifier for STT-MRAM
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Metadata
Title
Dynamic Response Characteristics of the PCB Under Thermo-Acoustic Load
Authors
Cunxian Cao
Jiangfeng Huang
Daoqing Qu
Miao Zhang
Copyright Year
2016
Publisher
Springer Singapore
Book
Computer Engineering and Technology

Print ISBN: 978-981-10-3158-8

Electronic ISBN: 978-981-10-3159-5

Copyright Year: 2016

DOI
https://doi.org/10.1007/978-981-10-3159-5_21