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Journal of Mechanical Science and Technology
Published in:

01-12-2016

Effect of conditioner load on the polishing pad surface during chemical mechanical planarization process

Authors: Cheolmin Shin, Hongyi Qin, Seokjun Hong, Sanghyuk Jeon, Atul Kulkarni, Taesung Kim

Published in: Journal of Mechanical Science and Technology | Issue 12/2016

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Metadata
Title
Effect of conditioner load on the polishing pad surface during chemical mechanical planarization process
Authors
Cheolmin Shin
Hongyi Qin
Seokjun Hong
Sanghyuk Jeon
Atul Kulkarni
Taesung Kim
Publication date
01-12-2016
Publisher
Korean Society of Mechanical Engineers
Published in
Journal of Mechanical Science and Technology / Issue 12/2016
Print ISSN: 1738-494X
Electronic ISSN: 1976-3824
DOI
https://doi.org/10.1007/s12206-016-1135-0

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Stiffness characteristics of compliant three segment leg with the self-stable region in slow and fast running

Trajectory generation to suppress oscillations in under-constrained cable-driven parallel robots

Dynamic simulation of a circulating fluidized bed boiler system Part I: Description of the dynamic system and transient behavior of sub-models

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