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Published in:

01-12-2016

Effect of conditioner load on the polishing pad surface during chemical mechanical planarization process

Authors: Cheolmin Shin, Hongyi Qin, Seokjun Hong, Sanghyuk Jeon, Atul Kulkarni, Taesung Kim

Published in: Journal of Mechanical Science and Technology | Issue 12/2016

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Title: Effect of conditioner load on the polishing pad surface during chemical mechanical planarization process
Authors: Cheolmin Shin
Hongyi Qin
Seokjun Hong
Sanghyuk Jeon
Atul Kulkarni
Taesung Kim
Publication date: 01-12-2016
Publisher: Korean Society of Mechanical Engineers
Published in: Journal of Mechanical Science and Technology / Issue 12/2016
Print ISSN: 1738-494X
Electronic ISSN: 1976-3824
DOI: https://doi.org/10.1007/s12206-016-1135-0

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