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Journal of Materials Science: Materials in Electronics
Published in: Journal of Materials Science: Materials in Electronics 16/2019

18-07-2019

Effect of Cu electroless plating on thermoelectric properties of n-type Bi2Te2.4Se0.6 alloy

Authors: Zhong-yue Huang, Hao-qiang Li, Xiao-yu Wang, Wei Jiang, Fang-qiu Zu

Published in: Journal of Materials Science: Materials in Electronics | Issue 16/2019

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Abstract

Thermoelectric material is a new functional material that can convert thermal energy into electrical energy, and it has been widely concerned because it can be used as alternative energy in many applications. Bi2Te2.4Se0.6 nanopowders were prepared by electroless plating, and then sintered into bulk by spark plasma sintering. After electroless plating, the thermal conductivity of n-type Bi2Te2.4Se0.6/Cu thermoelectric materials has been significantly reduced due to decreased electronic thermal conductivity and phonon scattering caused by large grain boundaries and defects, of which 0.15 wt%Cu/Bi2Te2.4Se0.6 has the lowest lattice thermal conductivity and reached 0.43 W m−1 k−1. The results show that the average zT value of all components has been enhanced to a certain extent, of which the average zT value of 0.15 wt%Cu/Bi2Te2.4Se0.6 reached 0.89, and the peak zT reached 0.98 at 401 K.
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Metadata
Title
Effect of Cu electroless plating on thermoelectric properties of n-type Bi2Te2.4Se0.6 alloy
Authors
Zhong-yue Huang
Hao-qiang Li
Xiao-yu Wang
Wei Jiang
Fang-qiu Zu
Publication date
18-07-2019
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 16/2019
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-019-01874-0

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