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Journal of Materials Science: Materials in Electronics

Published in:

02-01-2019

Effect of curing agent and curing substrate on low temperature curable silver conductive adhesive

Authors: Xiao-Qing Wang, Wei-Ping Gan, Feng Xiang, Bi-Yuan Li

Published in: Journal of Materials Science: Materials in Electronics | Issue 3/2019

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Abstract

Soldering technology is popularly used as a traditional connecting technology in electronics industry. But this technology often hurts components more or less due to its high temperature processing. Electrical conductive adhesive as a substitute for solder in connecting technology, can reduce harm to components. When preparing curable conductive adhesive, curing agent is necessary for curing process. But conductive adhesives with different types of curing agents have different curing temperatures, curing time and electric conductivity. In this paper, three types of conductive adhesives with different curing agents named dicyandiamide, p-hydroxyphenylacetic acid (HPA), tetraethylenepentamine are being compared. Through resistivity test and differential thermal analysis (DTA), it is found that the conductive adhesive sample using tetraethylenepentamine has the lowest curing temperature and resistivity. Therefore, using tetraethylenepentamine to prepare curable conductive adhesive will be a better choice compared with other two curing agents.

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Title: Effect of curing agent and curing substrate on low temperature curable silver conductive adhesive
Authors: Xiao-Qing Wang
Wei-Ping Gan
Feng Xiang
Bi-Yuan Li
Publication date: 02-01-2019
Publisher: Springer US
Published in: Journal of Materials Science: Materials in Electronics / Issue 3/2019
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI: https://doi.org/10.1007/s10854-018-0559-y

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