Skip to main content
Top

Effect of immersion time on morphology and resistive switching of CsPbBr₃ films via two-step spin-coating

  • 01-12-2025
Published in:

Activate our intelligent search to find suitable subject content or patents.

search-config
loading …

Abstract

This article delves into the critical role of immersion time in the two-step spin-coating process for fabricating CsPbBr₃ films, focusing on its impact on morphology, crystallinity, and resistive switching behavior. Through comprehensive SEM and XRD analyses, the study reveals how varying immersion durations influence grain growth, film uniformity, and phase purity. Electrical measurements demonstrate that a 20-minute immersion yields the most stable bipolar switching, with a high ON/OFF ratio and excellent endurance and retention characteristics. The article establishes a clear process–structure–property relationship, highlighting immersion time as a key parameter for achieving optimized electrical stability in perovskite-based RRAM devices. It provides valuable guidance for the rational design and scalable fabrication of high-performance memory technologies, making it an essential read for professionals seeking to advance their understanding of nonvolatile memory solutions.

Not a customer yet? Then find out more about our access models now:

Individual Access

Start your personal individual access now. Get instant access to more than 164,000 books and 540 journals – including PDF downloads and new releases.

Starting from 54,00 € per month!    

Get access

Access for Businesses

Utilise Springer Professional in your company and provide your employees with sound specialist knowledge. Request information about corporate access now.

Find out how Springer Professional can uplift your work!

Contact us now
Title
Effect of immersion time on morphology and resistive switching of CsPbBr₃ films via two-step spin-coating
Authors
Chih-Chiang Yang
Yu-Chun Huang
Bo-Yuan Gong
Yu-Ming Peng
Yan-Kuin Su
Publication date
01-12-2025
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 34/2025
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-025-16270-0
This content is only visible if you are logged in and have the appropriate permissions.