Skip to main content
Top
Published in: Journal of Materials Science: Materials in Electronics 3/2019

02-01-2019

Effect of SiC reinforcement on the reliability of Ag nanoparticle paste for high-temperature applications

Authors: Bo Hu, Fan Yang, Ye Peng, Chunjin Hang, Hongtao Chen, Changwoo Lee, Shihua Yang, Mingyu Li

Published in: Journal of Materials Science: Materials in Electronics | Issue 3/2019

Log in

Activate our intelligent search to find suitable subject content or patents.

search-config
loading …

Abstract

Ag nanoparticle (NP) paste is considered to be a next-generation thermal interface material. However, its sintered microstructure is at risk of volume shrinkage and mechanical property degradation under harsh environments. In this work, silicon carbide (SiC) NPs were mixed with Ag NP paste to improve the stability and reliability of sintered Ag joints. Robust joints were prepared by a rapid thermal compression method at 275 °C for 20 s. Although the addition of SiC NPs degraded the initial shear strengths of these joints, the SiC-containing joints exhibited excellent mechanical properties and microstructural stability during thermal shock tests from − 50 to 150 °C for up to 1000 cycles. When the added amount of SiC NPs was 2%, the joints achieved the highest shear strength of 87.1 MPa (after 1000 cycles). In addition, the shear strengths of the joints were investigated at 250 °C. The addition of SiC NPs is believed to enhance the reliability of joints at high temperature.

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Springer Professional "Wirtschaft"

Online-Abonnement

Mit Springer Professional "Wirtschaft" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 340 Zeitschriften

aus folgenden Fachgebieten:

  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Versicherung + Risiko




Jetzt Wissensvorsprung sichern!

Literature
1.
go back to reference P. Peng, A. Hu, A.P. Gerlich, G. Zou, L. Liu, Y.N. Zhou, Joining of silver nanomaterials at low temperatures: processes, properties, and applications. ACS Appl. Mater. Interfaces. 7, 12597–12618 (2015)CrossRef P. Peng, A. Hu, A.P. Gerlich, G. Zou, L. Liu, Y.N. Zhou, Joining of silver nanomaterials at low temperatures: processes, properties, and applications. ACS Appl. Mater. Interfaces. 7, 12597–12618 (2015)CrossRef
2.
go back to reference V.R. Manikam, K.Y. Cheong, Die attach materials for high temperature applications: a review. IEEE Trans. Compon. Packag. Manuf. Technol. 1, 457–478 (2011)CrossRef V.R. Manikam, K.Y. Cheong, Die attach materials for high temperature applications: a review. IEEE Trans. Compon. Packag. Manuf. Technol. 1, 457–478 (2011)CrossRef
3.
go back to reference K.S. Siow, Mechanical properties of nano-silver joints as die attach materials. J. Alloys Compd. 514, 6–19 (2012)CrossRef K.S. Siow, Mechanical properties of nano-silver joints as die attach materials. J. Alloys Compd. 514, 6–19 (2012)CrossRef
4.
go back to reference M.Y. Li, Y. Xiao, Z.H. Zhang, J. Yu, Bimodal sintered silver nanoparticle paste with ultrahigh thermal conductivity and shear strength for high temperature thermal interface material applications. ACS Appl. Mater. Interfaces 7, 9157–9168 (2015)CrossRef M.Y. Li, Y. Xiao, Z.H. Zhang, J. Yu, Bimodal sintered silver nanoparticle paste with ultrahigh thermal conductivity and shear strength for high temperature thermal interface material applications. ACS Appl. Mater. Interfaces 7, 9157–9168 (2015)CrossRef
5.
go back to reference T. Ishizaki, R. Watanabe, A new one-pot method for the synthesis of Cu nanoparticles for low temperature bonding. J. Mater. Chem. 22, 25198–25206 (2012)CrossRef T. Ishizaki, R. Watanabe, A new one-pot method for the synthesis of Cu nanoparticles for low temperature bonding. J. Mater. Chem. 22, 25198–25206 (2012)CrossRef
6.
go back to reference J. Liu, H. Chen, H. Ji, M. Li, Highly conductive Cu-Cu joint formation by low-temperature sintering of formic acid-treated Cu nanoparticles. ACS Appl. Mater. Interfaces 8, 33289 (2016)CrossRef J. Liu, H. Chen, H. Ji, M. Li, Highly conductive Cu-Cu joint formation by low-temperature sintering of formic acid-treated Cu nanoparticles. ACS Appl. Mater. Interfaces 8, 33289 (2016)CrossRef
7.
go back to reference M. Tsuji, S. Hikino, M. Matsunaga, Y. Sano, T. Hashizume, H. Kawazumi, Rapid synthesis of Ag@Ni core–shell nanoparticles using a microwave-polyol method. Mater. Lett. 64, 1793–1797 (2010)CrossRef M. Tsuji, S. Hikino, M. Matsunaga, Y. Sano, T. Hashizume, H. Kawazumi, Rapid synthesis of Ag@Ni core–shell nanoparticles using a microwave-polyol method. Mater. Lett. 64, 1793–1797 (2010)CrossRef
8.
go back to reference E. Ide, S. Angata, A. Hirose, K.F. Kobayashi, Metal–metal bonding process using Ag metallo-organic nanoparticles. Acta Mater. 53, 2385–2393 (2005)CrossRef E. Ide, S. Angata, A. Hirose, K.F. Kobayashi, Metal–metal bonding process using Ag metallo-organic nanoparticles. Acta Mater. 53, 2385–2393 (2005)CrossRef
9.
go back to reference T. Wang, X. Chen, G.Q. Lu, G.Y. Lei, Low-temperature sintering with nano-silver paste in die-attached interconnection. J. Electron. Mater. 36, 1333–1340 (2007)CrossRef T. Wang, X. Chen, G.Q. Lu, G.Y. Lei, Low-temperature sintering with nano-silver paste in die-attached interconnection. J. Electron. Mater. 36, 1333–1340 (2007)CrossRef
10.
go back to reference H. Ogura, M. Maruyama, R. Matsubayashi, T. Ogawa, S. Nakamura, T. Komatsu, H. Nagasawa, A. Ichimura, S. Isoda, Carboxylate-passivated silver nanoparticles and their application to sintered interconnection: a replacement for high temperature lead-rich solders. J. Electron. Mater. 39, 1233–1240 (2010)CrossRef H. Ogura, M. Maruyama, R. Matsubayashi, T. Ogawa, S. Nakamura, T. Komatsu, H. Nagasawa, A. Ichimura, S. Isoda, Carboxylate-passivated silver nanoparticles and their application to sintered interconnection: a replacement for high temperature lead-rich solders. J. Electron. Mater. 39, 1233–1240 (2010)CrossRef
11.
go back to reference J. Li, C.M. Johnson, C. Buttay, W. Sabbah, S. Azzopardi, Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles. J. Mater. Process. Technol. 215, 299–308 (2015)CrossRef J. Li, C.M. Johnson, C. Buttay, W. Sabbah, S. Azzopardi, Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles. J. Mater. Process. Technol. 215, 299–308 (2015)CrossRef
12.
go back to reference S. Wang, M. Li, H. Ji, C. Wang, Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging. Scr. Mater. 69, 789–792 (2013)CrossRef S. Wang, M. Li, H. Ji, C. Wang, Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging. Scr. Mater. 69, 789–792 (2013)CrossRef
13.
go back to reference H. Yu, L. Li, Y. Zhang, Silver nanoparticle-based thermal interface materials with ultra-low thermal resistance for power electronics applications. Scr. Mater. 66, 931–934 (2012)CrossRef H. Yu, L. Li, Y. Zhang, Silver nanoparticle-based thermal interface materials with ultra-low thermal resistance for power electronics applications. Scr. Mater. 66, 931–934 (2012)CrossRef
14.
go back to reference Y. Xie, Y. Wang, Y. Mei, H. Xie, K. Zhang, S. Feng, K.S. Siow, X. Li, G.Q. Lu, Rapid sintering of nano-Ag paste at low current to bond large area (> 100 mm2) power chips for electronics packaging. J. Mater. Process. Technol. 255, 644–649 (2018)CrossRef Y. Xie, Y. Wang, Y. Mei, H. Xie, K. Zhang, S. Feng, K.S. Siow, X. Li, G.Q. Lu, Rapid sintering of nano-Ag paste at low current to bond large area (> 100 mm2) power chips for electronics packaging. J. Mater. Process. Technol. 255, 644–649 (2018)CrossRef
15.
go back to reference L. Jiang, T.G. Lei, K.D.T. Ngo, G.Q. Lu, S. Luo, Evaluation of thermal cycling reliability of sintered nanosilver versus soldered joints by curvature measurement. IEEE Trans. Compon. Packag. Manuf. Technol. 4, 751–761 (2014)CrossRef L. Jiang, T.G. Lei, K.D.T. Ngo, G.Q. Lu, S. Luo, Evaluation of thermal cycling reliability of sintered nanosilver versus soldered joints by curvature measurement. IEEE Trans. Compon. Packag. Manuf. Technol. 4, 751–761 (2014)CrossRef
16.
go back to reference W. Sabbah, S. Azzopardi, C. Buttay, R. Meuret, E. Woirgard, Study of die attach technologies for high temperature power electronics: Silver sintering and gold–germanium alloy. Microelectron. Reliab. 53, 1617–1621 (2013)CrossRef W. Sabbah, S. Azzopardi, C. Buttay, R. Meuret, E. Woirgard, Study of die attach technologies for high temperature power electronics: Silver sintering and gold–germanium alloy. Microelectron. Reliab. 53, 1617–1621 (2013)CrossRef
17.
go back to reference J. Li, X. Li, L. Wang, Y.H. Mei, G.Q. Lu, A novel multiscale silver paste for die bonding on bare copper by low-temperature pressure-free sintering in air. Mater. Des. 140, 64–72 (2017)CrossRef J. Li, X. Li, L. Wang, Y.H. Mei, G.Q. Lu, A novel multiscale silver paste for die bonding on bare copper by low-temperature pressure-free sintering in air. Mater. Des. 140, 64–72 (2017)CrossRef
18.
go back to reference S.Y. Zhao, X. Li, Y.H. Mei, G.Q. Lu, Effect of silver flakes in silver paste on the joining process and properties of sandwich power modules (IGBTs chip/silver paste/bare Cu). J. Electron. Mater. 45, 1–11 (2016)CrossRef S.Y. Zhao, X. Li, Y.H. Mei, G.Q. Lu, Effect of silver flakes in silver paste on the joining process and properties of sandwich power modules (IGBTs chip/silver paste/bare Cu). J. Electron. Mater. 45, 1–11 (2016)CrossRef
19.
go back to reference H. Zhang, C. Chen, S. Nagao, K. Suganuma, Thermal fatigue behavior of silicon-carbide-doped silver microflake sinter joints for die attachment in silicon/silicon carbide power devices. J. Electron. Mater. 46, 1055–1060 (2017)CrossRef H. Zhang, C. Chen, S. Nagao, K. Suganuma, Thermal fatigue behavior of silicon-carbide-doped silver microflake sinter joints for die attachment in silicon/silicon carbide power devices. J. Electron. Mater. 46, 1055–1060 (2017)CrossRef
20.
go back to reference H. Zhang, S. Nagao, K. Suganuma, Addition of SiC particles to Ag die-attach paste to improve high-temperature stability; grain growth kinetics of sintered porous Ag. J. Electron. Mater. 44, 1–8 (2015)CrossRef H. Zhang, S. Nagao, K. Suganuma, Addition of SiC particles to Ag die-attach paste to improve high-temperature stability; grain growth kinetics of sintered porous Ag. J. Electron. Mater. 44, 1–8 (2015)CrossRef
21.
go back to reference J.G. Bai, J.N. Calata, G.Q. Lu, Processing and characterization of nanosilver pastes for die-attaching SiC devices. IEEE Trans. Electron. Packag. Manuf. 30, 241–245 (2007)CrossRef J.G. Bai, J.N. Calata, G.Q. Lu, Processing and characterization of nanosilver pastes for die-attaching SiC devices. IEEE Trans. Electron. Packag. Manuf. 30, 241–245 (2007)CrossRef
22.
go back to reference S. Sakamoto, T. Sugahara, K. Suganuma, Microstructural stability of Ag sinter joining in thermal cycling. J. Mater. Sci. 24, 1332–1340 (2013) S. Sakamoto, T. Sugahara, K. Suganuma, Microstructural stability of Ag sinter joining in thermal cycling. J. Mater. Sci. 24, 1332–1340 (2013)
23.
go back to reference R. Mahmudi, S. Alibabaie, Elevated-temperature shear strength and hardness of Zn–3Cu–xAl ultra-high-temperature lead-free solders. Mater. Sci. Eng. A 559, 421–426 (2013)CrossRef R. Mahmudi, S. Alibabaie, Elevated-temperature shear strength and hardness of Zn–3Cu–xAl ultra-high-temperature lead-free solders. Mater. Sci. Eng. A 559, 421–426 (2013)CrossRef
Metadata
Title
Effect of SiC reinforcement on the reliability of Ag nanoparticle paste for high-temperature applications
Authors
Bo Hu
Fan Yang
Ye Peng
Chunjin Hang
Hongtao Chen
Changwoo Lee
Shihua Yang
Mingyu Li
Publication date
02-01-2019
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 3/2019
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-018-0514-y

Other articles of this Issue 3/2019

Journal of Materials Science: Materials in Electronics 3/2019 Go to the issue