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Journal of Electronic Materials
Published in: Journal of Electronic Materials 3/2018

19-12-2017

Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints

Authors: Jian Lin, Yongping Lei, Hanguang Fu, Fu Guo

Published in: Journal of Electronic Materials | Issue 3/2018

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Metadata
Title
Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints
Authors
Jian Lin
Yongping Lei
Hanguang Fu
Fu Guo
Publication date
19-12-2017
Publisher
Springer US
Published in
Journal of Electronic Materials / Issue 3/2018
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI
https://doi.org/10.1007/s11664-017-6014-7

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