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2023 | OriginalPaper | Chapter

Effects of Diameter on Copper Pillar with Solder Cap Interconnections During Reflow Soldering Process

Authors : Jing Rou Lee, Mohd Sharizal Abdul Aziz, Mohd Arif Anuar Mohd Salleh, Chu Yee Khor, Mohammad Hafifi Hafiz Ishak

Published in: TMS 2023 152nd Annual Meeting & Exhibition Supplemental Proceedings

Publisher: Springer Nature Switzerland

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Abstract

Recently, the copper pillar with solder cap interconnection has been introduced as an alternative for the solder bump interconnection to tackle the limitations, such as the collapsing nature of the solder bump and larger pitch size. This paper presents an effective simulation tool to evaluate the effects of different diameters of the copper pillar with solder cap during the reflow soldering process. A three-dimensional numerical approach is used to investigate the thermal behavior of the copper pillar with solder caps with different diameters. The interconnection bump diameters are 150, 200, 250, 300, and 350 μm. The model is developed and meshed using the Computational Fluid Dynamics (CFD) software. The temperature distributions of the copper pillar with solder caps with different diameters during the reflow soldering process are predicted. The paper aims to provide an understanding of the effect of diameters on the temperature distribution of copper pillars with solder caps during reflow soldering.

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Metadata
Title
Effects of Diameter on Copper Pillar with Solder Cap Interconnections During Reflow Soldering Process
Authors
Jing Rou Lee
Mohd Sharizal Abdul Aziz
Mohd Arif Anuar Mohd Salleh
Chu Yee Khor
Mohammad Hafifi Hafiz Ishak
Copyright Year
2023
Book
TMS 2023 152nd Annual Meeting & Exhibition Supplemental Proceedings

Print ISBN: 978-3-031-22523-9

Electronic ISBN: 978-3-031-22524-6

Copyright Year: 2023

DOI
https://doi.org/10.1007/978-3-031-22524-6_84

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