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Published in: Microsystem Technologies 10/2021

03-01-2021 | Technical Paper

Effects of fringing capacitances and electrode’s finiteness in improved SiC membrane based micromachined ultrasonic transducers

Authors: Moumita Pal, C. Lalengkima, Reshmi Maity, Srimanta Baishya, N. P. Maity

Published in: Microsystem Technologies | Issue 10/2021

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Abstract

The influence of fringing electric fields at the edges of the Capacitance Micromachined Ultrasonic Transducer’s (CMUT’s) gap and insulation layers are included into the parallel plate capacitance phenomenon. Its effect on various CMUT parameters are derived and compared to Finite Element Analysis (FEA) predictions. This gives rise to excess capacitances. A correction factor due to the finiteness of the electrode’s diameter in nanostructure devices is introduced for accurate prediction. Inclusion of an insulation layer helps in improving the performance of the ultrasonic transducer in comparison to a structure devoid of it. Analytical modelling of the structure as ultrasound transmitter consisting of 110 µm diameter membrane arrays exhibits a resonance of 1.65 MHz, which closely matches with published experimental data is carried out. CMUT with Si3N4 as insulation layer has higher device capacitance, increased membrane displacement, higher coupling factor, and lower collapse voltage as compared to a structure without insulation at the same bias, structural dimensions, and material properties. The characteristics exhibited by the insulated structure are advantageous as a transducer. All the results are compared with FEA where excellent agreement is observed.

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Literature
go back to reference Apte N, Park K, Khuri Y, Butrus T (2012). Finite element analysis of CMUTs with pressurized cavities. In: IEEE Ultrasonics Symposium, pp 979–982 Apte N, Park K, Khuri Y, Butrus T (2012). Finite element analysis of CMUTs with pressurized cavities. In: IEEE Ultrasonics Symposium, pp 979–982
go back to reference Baran J, Webster J (2009) Design of low-cost portable ultrasound systems: review. In: Proceedings of the Annual International Conference on IEEE Engineering in Medicine and Biology Society, pp 792–795 Baran J, Webster J (2009) Design of low-cost portable ultrasound systems: review. In: Proceedings of the Annual International Conference on IEEE Engineering in Medicine and Biology Society, pp 792–795
go back to reference Bhuyan A, Choe J, Lee B, Wygant I, Nikoozadeh A, Oralkan O, Khuri-Yakub BT (2013) Integrated circuits for volumetric ultrasound imaging with 2-D CMUT arrays. IEEE Trans Biomed Circuits Syst 7(6):796–804CrossRef Bhuyan A, Choe J, Lee B, Wygant I, Nikoozadeh A, Oralkan O, Khuri-Yakub BT (2013) Integrated circuits for volumetric ultrasound imaging with 2-D CMUT arrays. IEEE Trans Biomed Circuits Syst 7(6):796–804CrossRef
go back to reference Bozkurt A, Goksenin YG (2016) Receive-noise analysis of capacitive micromachined ultrasonic transducers. IEEE Trans Ultrason Ferroelectr Freq Control 63(11):1980–1988CrossRef Bozkurt A, Goksenin YG (2016) Receive-noise analysis of capacitive micromachined ultrasonic transducers. IEEE Trans Ultrason Ferroelectr Freq Control 63(11):1980–1988CrossRef
go back to reference Caronti A, Majjad H, Ballandras S, Caliano G, Carotenuto R, Iula A, Foglietti V, Pappalardo M (2002) Vibration maps of capacitive micromachined ultrasonic transducers by laser interferometry. IEEE Trans Ultrason Ferroelectr Freq Control 49(3):289–292CrossRef Caronti A, Majjad H, Ballandras S, Caliano G, Carotenuto R, Iula A, Foglietti V, Pappalardo M (2002) Vibration maps of capacitive micromachined ultrasonic transducers by laser interferometry. IEEE Trans Ultrason Ferroelectr Freq Control 49(3):289–292CrossRef
go back to reference Choe JW, Oralkan O, Nikoozadeh A, Gencel M, Stephens DN, O’Donnell M, Sahn DJ, Khuri-Yakub BT (2012) Volumetric real-time imaging using a CMUT ring array. IEEE Trans Ultrason Ferroelectr Freq Control 59(6):1201–1212CrossRef Choe JW, Oralkan O, Nikoozadeh A, Gencel M, Stephens DN, O’Donnell M, Sahn DJ, Khuri-Yakub BT (2012) Volumetric real-time imaging using a CMUT ring array. IEEE Trans Ultrason Ferroelectr Freq Control 59(6):1201–1212CrossRef
go back to reference Degertekin FL, Guldiken RO, Karaman M (2006) Annular-ring CMUT arrays for forward-looking IVUS: transducer characterization and imaging. IEEE Trans Ultrason Ferroelectr Freq Control 53(2):474–483CrossRef Degertekin FL, Guldiken RO, Karaman M (2006) Annular-ring CMUT arrays for forward-looking IVUS: transducer characterization and imaging. IEEE Trans Ultrason Ferroelectr Freq Control 53(2):474–483CrossRef
go back to reference Farhanieh O, Sahafi A, Roy RB, Ergun AS, Bozkurt A (2017) Integrated HIFU drive system on a chip for CMUT-based catheter ablation system. IEEE Trans Biomed Circuits Syst 11(3):534–547CrossRef Farhanieh O, Sahafi A, Roy RB, Ergun AS, Bozkurt A (2017) Integrated HIFU drive system on a chip for CMUT-based catheter ablation system. IEEE Trans Biomed Circuits Syst 11(3):534–547CrossRef
go back to reference Gurun G, Tekes C, Zahorian J, Xu T, Satir S, Karaman M, Hasler J, Degertekin FL (2014) Single-chip CMUT-on-CMOS front-end system for real-time volumetric IVUS and ICE imaging. IEEE Trans Ultrason Ferroelectr Freq Control 61(2):239–250CrossRef Gurun G, Tekes C, Zahorian J, Xu T, Satir S, Karaman M, Hasler J, Degertekin FL (2014) Single-chip CMUT-on-CMOS front-end system for real-time volumetric IVUS and ICE imaging. IEEE Trans Ultrason Ferroelectr Freq Control 61(2):239–250CrossRef
go back to reference Ihsan C, Bozkurt A, Karaman M (2005) Design of a front-end integrated circuit for 3D acoustic imaging using 2D CMUT arrays. IEEE Trans Ultrason Ferroelectr Freq Control 52(12):2235–2242CrossRef Ihsan C, Bozkurt A, Karaman M (2005) Design of a front-end integrated circuit for 3D acoustic imaging using 2D CMUT arrays. IEEE Trans Ultrason Ferroelectr Freq Control 52(12):2235–2242CrossRef
go back to reference Jin X, Oralkan O, Degertekin FL, Khuri-Yakub BT (2001) Characterization of one-dimensional capacitive micromachined ultrasonic immersion transducer arrays. IEEE Trans Ultrason Ferroelectr Freq Control 48(3):750–761CrossRef Jin X, Oralkan O, Degertekin FL, Khuri-Yakub BT (2001) Characterization of one-dimensional capacitive micromachined ultrasonic immersion transducer arrays. IEEE Trans Ultrason Ferroelectr Freq Control 48(3):750–761CrossRef
go back to reference Johnson J, Oralkan O, Demirci U, Ergun S, Karaman M, Khuri-Yakub P (2002) Medical imaging using capacitive micromachined ultrasonic transducer arrays. Ultrasonics 40:471–476CrossRef Johnson J, Oralkan O, Demirci U, Ergun S, Karaman M, Khuri-Yakub P (2002) Medical imaging using capacitive micromachined ultrasonic transducer arrays. Ultrasonics 40:471–476CrossRef
go back to reference Kim GD, Yoon C, Kye S, Lee Y, Kang J, Yoo Y, Song T (2012) A single FPGA-based portable ultrasound imaging system for point of-care applications. IEEE Trans Ultrason Ferroelectr Freq Control 59(7):1386–1394CrossRef Kim GD, Yoon C, Kye S, Lee Y, Kang J, Yoo Y, Song T (2012) A single FPGA-based portable ultrasound imaging system for point of-care applications. IEEE Trans Ultrason Ferroelectr Freq Control 59(7):1386–1394CrossRef
go back to reference Kim K, Kim M, Joo H, Lee W, Yoon C, Song T, Yoo Y (2013) Smartphone-based portable ultrasound imaging system: a primary result. IEEE Ultrasonics Symposium, pp 2061–2063 Kim K, Kim M, Joo H, Lee W, Yoon C, Song T, Yoo Y (2013) Smartphone-based portable ultrasound imaging system: a primary result. IEEE Ultrasonics Symposium, pp 2061–2063
go back to reference Landau L, Lifschitz E (1987) Electrodynamics of continuous media. Permagon Press, Oxford Landau L, Lifschitz E (1987) Electrodynamics of continuous media. Permagon Press, Oxford
go back to reference Lin D-S, Wodnicki R, Zhuang X, Woychik C, Thomenius KE, Fisher RA, Mills DM, Byun AJ, Burdick W, Khuri-Yakub P, Bonitz B, Davies T, Thomas G, Otto B, Topper M, Fritzsch T, Ehrmann O (2013) Packaging and modular assembly of large-area and fine-pitch 2-D ultrasonic transducer arrays. IEEE Trans Ultrason Ferroelectr Freq Control 60(7):1356–1376CrossRef Lin D-S, Wodnicki R, Zhuang X, Woychik C, Thomenius KE, Fisher RA, Mills DM, Byun AJ, Burdick W, Khuri-Yakub P, Bonitz B, Davies T, Thomas G, Otto B, Topper M, Fritzsch T, Ehrmann O (2013) Packaging and modular assembly of large-area and fine-pitch 2-D ultrasonic transducer arrays. IEEE Trans Ultrason Ferroelectr Freq Control 60(7):1356–1376CrossRef
go back to reference Maity R, Maity NP, Thapa RK, Baishya S (2017a) An improved analytical and finite element method model of nanoelectromechanical system based micromachined ultrasonic transducers. Microsyst Technol 23(6):2163–2173CrossRef Maity R, Maity NP, Thapa RK, Baishya S (2017a) An improved analytical and finite element method model of nanoelectromechanical system based micromachined ultrasonic transducers. Microsyst Technol 23(6):2163–2173CrossRef
go back to reference Maity R, Maity NP, Baishya S (2017b) Circular membrane approximation model with the effect of the finiteness of the electrode’s diameter of MEMS capacitive micromachined ultrasonic transducer. Microsyst Technol 23:3513–3524CrossRef Maity R, Maity NP, Baishya S (2017b) Circular membrane approximation model with the effect of the finiteness of the electrode’s diameter of MEMS capacitive micromachined ultrasonic transducer. Microsyst Technol 23:3513–3524CrossRef
go back to reference Maity R, Maity NP, Guha K, Baishya S (2018a) Analysis of fringing capacitance effect on the performance of MEMS based micromachined ultrasonic air transducer. IET Micro Nano Lett 13(6):872–877CrossRef Maity R, Maity NP, Guha K, Baishya S (2018a) Analysis of fringing capacitance effect on the performance of MEMS based micromachined ultrasonic air transducer. IET Micro Nano Lett 13(6):872–877CrossRef
go back to reference Maity R, Maity NP, Srinivasa Rao K, Guha K, Baishya S (2018b) A new compact analytical model of nano-electro-mechanical-systems based capacitive micromachined ultrasonic transducers for pulse echo imaging. J Comput Electron 17(3):1334–1342CrossRef Maity R, Maity NP, Srinivasa Rao K, Guha K, Baishya S (2018b) A new compact analytical model of nano-electro-mechanical-systems based capacitive micromachined ultrasonic transducers for pulse echo imaging. J Comput Electron 17(3):1334–1342CrossRef
go back to reference Maity R, Maity NP, Baishya S (2020) An efficient model of nanoelectromechanical systems based ultrasonic sensor with fringing field effects. IEEE Sens J 20(4):1746–1753CrossRef Maity R, Maity NP, Baishya S (2020) An efficient model of nanoelectromechanical systems based ultrasonic sensor with fringing field effects. IEEE Sens J 20(4):1746–1753CrossRef
go back to reference Maity NP, Thakur RR, Maity R, Thapa RK, Baishya S (2016) Analysis of interface charge densities for high-k dielectric materials based metal-oxide-semiconductor devices. Int J Nanosci 15(3):1660011:1–6CrossRef Maity NP, Thakur RR, Maity R, Thapa RK, Baishya S (2016) Analysis of interface charge densities for high-k dielectric materials based metal-oxide-semiconductor devices. Int J Nanosci 15(3):1660011:1–6CrossRef
go back to reference Oralkan O, Jin X, DegertekinLevent XF, Khuri-Yakub BT (1999) Simulation and experimental characterization of a 2-D capacitive micromachined ultrasonic transducer array element. IEEE Trans Ultrason Ferroelectr Freq Control 46(6):1337–1340CrossRef Oralkan O, Jin X, DegertekinLevent XF, Khuri-Yakub BT (1999) Simulation and experimental characterization of a 2-D capacitive micromachined ultrasonic transducer array element. IEEE Trans Ultrason Ferroelectr Freq Control 46(6):1337–1340CrossRef
go back to reference Oralkan O, Ergun AS, Cheng C-H, Johnson JA, Karaman M, Lee TH, Khuri-Yakub BT (2003) Volumetric ultrasound imaging using 2-D CMUT arrays. IEEE Trans Ultrason Ferroelectr Freq Control 50(11):1581–1595CrossRef Oralkan O, Ergun AS, Cheng C-H, Johnson JA, Karaman M, Lee TH, Khuri-Yakub BT (2003) Volumetric ultrasound imaging using 2-D CMUT arrays. IEEE Trans Ultrason Ferroelectr Freq Control 50(11):1581–1595CrossRef
go back to reference Tasy N, Sonnenberg T, Jansen H, Legtenberg R, Elwenspoek M (1996) Stiction in surface micromachining. J Micromech Microeng 6(4):385–397CrossRef Tasy N, Sonnenberg T, Jansen H, Legtenberg R, Elwenspoek M (1996) Stiction in surface micromachining. J Micromech Microeng 6(4):385–397CrossRef
go back to reference Wygant I, Zhuang X, Yeh D, Oralkan O, Ergun AS, Karaman M, Khuri-Yakub BT (2008) Integration of 2D CMUT arrays with front-end electronics for volumetric ultrasound imaging. IEEE Trans Ultrason Ferroelectr Freq Control 55(2):327–342CrossRef Wygant I, Zhuang X, Yeh D, Oralkan O, Ergun AS, Karaman M, Khuri-Yakub BT (2008) Integration of 2D CMUT arrays with front-end electronics for volumetric ultrasound imaging. IEEE Trans Ultrason Ferroelectr Freq Control 55(2):327–342CrossRef
go back to reference Wygant I, Jamal N, Lee H, Nikoozadeh A, Oralkan O, Karaman M, Khuri-Yakub BT (2009) An integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imaging. IEEE Trans Ultrason Ferroelectr Freq Control 56(10):2145–2156CrossRef Wygant I, Jamal N, Lee H, Nikoozadeh A, Oralkan O, Karaman M, Khuri-Yakub BT (2009) An integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imaging. IEEE Trans Ultrason Ferroelectr Freq Control 56(10):2145–2156CrossRef
go back to reference Zhang Q, Cicek PV, Allidina K, Nabki F, El-Gamal MN (2014) Surface-micromachined CMUT using low-temperature deposited silicon carbide membranes for above-IC integration. IEEE J Microelectromech Syst 23(2):482–494CrossRef Zhang Q, Cicek PV, Allidina K, Nabki F, El-Gamal MN (2014) Surface-micromachined CMUT using low-temperature deposited silicon carbide membranes for above-IC integration. IEEE J Microelectromech Syst 23(2):482–494CrossRef
Metadata
Title
Effects of fringing capacitances and electrode’s finiteness in improved SiC membrane based micromachined ultrasonic transducers
Authors
Moumita Pal
C. Lalengkima
Reshmi Maity
Srimanta Baishya
N. P. Maity
Publication date
03-01-2021
Publisher
Springer Berlin Heidelberg
Published in
Microsystem Technologies / Issue 10/2021
Print ISSN: 0946-7076
Electronic ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-020-05135-7

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