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Published in: Journal of Materials Science: Materials in Electronics 1/2015

01-01-2015

Effects of sputtering atmosphere on the properties of c-plane ScAlN thin films prepared on sapphire substrate

Authors: Yao Zhang, Weixin Zhu, Dong Zhou, Yixi Yang, Chengtao Yang

Published in: Journal of Materials Science: Materials in Electronics | Issue 1/2015

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Abstract

In this work, scandium aluminum nitride alloy (ScAlN) thin films were prepared on c-sapphire substrates by DC reactive magnetron sputtering with a scandium aluminum alloy (Sc0.06Al0.94) target. The crystal orientation and surface morphology were detected by XRD and AFM, respectively. The electrical properties were analyzed by a standard ferroelectric test system and piezoelectric response force microscopy. The results show that the sputtering atmosphere, including N2/Ar flow ratio and sputtering pressure, appears to be important to influence the crystal quality and electrical properties of ScAlN films. With the N2/Ar flow ratio increasing from 3.1:7 to 3.6:7, the crystal orientation and surface morphology of ScAlN films firstly improves and then gets worse. Meanwhile, the electrical qualities of the films performs a similar variation. When the sputtering pressure increases from 0.3 to 0.7 Pa, the properties of the films change obviously too, and the best sputtering pressure is determined as 0.5 Pa. Finally, highly c-axis ScAlN films can be obtained with a N2/Ar flow ratio of 3.4:7 and a sputtering pressure of 0.5 Pa, and the FWHM value of the rocking curve, the RMS roughness, the resistivity, the dielectric constant ɛr and piezoelectric constant d33 are 2.6°, 2.650 nm, 2.9 × 1012 Ω/cm, 12.2 and 8.1 pC/N, respectively.

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Literature
1.
go back to reference M.H. Lee, S.M. Chang, C.K. Park, J.B. Lee, J.S. Park, in Proceedings of IEEE international frequency control symposium/PDA exhibition, pp. 70–73 (2002) M.H. Lee, S.M. Chang, C.K. Park, J.B. Lee, J.S. Park, in Proceedings of IEEE international frequency control symposium/PDA exhibition, pp. 70–73 (2002)
2.
go back to reference P. Limsuwan, N. Udomkan, S. Meejoo, P. Winotai, Int. J. Mod. Phys. B 19, 2073 (2005)CrossRef P. Limsuwan, N. Udomkan, S. Meejoo, P. Winotai, Int. J. Mod. Phys. B 19, 2073 (2005)CrossRef
3.
go back to reference H. Jin, B. Feng, S. Dong, C. Zhou, J. Zhou, Y. Yang, J. Electron. Mater. 41, 1948 (2012)CrossRef H. Jin, B. Feng, S. Dong, C. Zhou, J. Zhou, Y. Yang, J. Electron. Mater. 41, 1948 (2012)CrossRef
4.
go back to reference N. Setter, D. Damjanovic, L. Eng, G. Fox, S. Gevorgian, S. Hong et al., J. Appl. Phys. 100, 109901 (2006)CrossRef N. Setter, D. Damjanovic, L. Eng, G. Fox, S. Gevorgian, S. Hong et al., J. Appl. Phys. 100, 109901 (2006)CrossRef
5.
6.
go back to reference J.P. Jung, J.B. Lee, J.S. Kim, J.S. Park, Thin Solid Films 447, 605–609 (2004)CrossRef J.P. Jung, J.B. Lee, J.S. Kim, J.S. Park, Thin Solid Films 447, 605–609 (2004)CrossRef
7.
go back to reference T. Aubert, M.B. Assouar, O. Legrani, O. Elmazria, C. Tiusan et al., J. Vac. Sci. Technol., A 29, 021010 (2011)CrossRef T. Aubert, M.B. Assouar, O. Legrani, O. Elmazria, C. Tiusan et al., J. Vac. Sci. Technol., A 29, 021010 (2011)CrossRef
8.
go back to reference M. Akiyama, T. Kamohara, K. Kano, A. Teshigahara, N. Kawahara, Appl. Phys. Lett. 93, 021903 (2008)CrossRef M. Akiyama, T. Kamohara, K. Kano, A. Teshigahara, N. Kawahara, Appl. Phys. Lett. 93, 021903 (2008)CrossRef
9.
go back to reference R. Matloub, A. Artieda, C. Sandu, E. Milyutin, P. Muralt, Appl. Phys. Lett. 99, 092903 (2011)CrossRef R. Matloub, A. Artieda, C. Sandu, E. Milyutin, P. Muralt, Appl. Phys. Lett. 99, 092903 (2011)CrossRef
10.
go back to reference M. Moreira, J. Bjurstrom, I. Katardjev, V. Yantchev, Vacuum 86, 23–26 (2011)CrossRef M. Moreira, J. Bjurstrom, I. Katardjev, V. Yantchev, Vacuum 86, 23–26 (2011)CrossRef
11.
go back to reference M. Akiyama, T. Kamohara, A. Teshigahara, Y. Takeuchi, N. Kawahara, Adv. Mater. 21, 593 (2009)CrossRef M. Akiyama, T. Kamohara, A. Teshigahara, Y. Takeuchi, N. Kawahara, Adv. Mater. 21, 593 (2009)CrossRef
12.
go back to reference F. Tasnádi, B. Alling, C.H. Öglund, G. Wingqvist, J. Birch, L. Hultman et al., Phys. Rev. Lett. 104, 137601 (2010)CrossRef F. Tasnádi, B. Alling, C.H. Öglund, G. Wingqvist, J. Birch, L. Hultman et al., Phys. Rev. Lett. 104, 137601 (2010)CrossRef
13.
go back to reference G. Wingqvist, F. Tasnádi, A. Zukauskaite, J. Birch, H. Arwin, L. Hultman, Appl. Phys. Lett. 97, 112902 (2010)CrossRef G. Wingqvist, F. Tasnádi, A. Zukauskaite, J. Birch, H. Arwin, L. Hultman, Appl. Phys. Lett. 97, 112902 (2010)CrossRef
14.
go back to reference K. Hashimoto, S. Sato, A. Teshigahara, T. Nakamura, K. Kano, IEEE Trans. Ultrason. Ferroelectr. Freq. Control 60(3), 637–642 (2013)CrossRef K. Hashimoto, S. Sato, A. Teshigahara, T. Nakamura, K. Kano, IEEE Trans. Ultrason. Ferroelectr. Freq. Control 60(3), 637–642 (2013)CrossRef
15.
go back to reference M. Akiyama, T. Tabaru, K. Nishikubo, A. Teshigahara, J. Ceram. Soc. Jpn. 118, 1166 (2010)CrossRef M. Akiyama, T. Tabaru, K. Nishikubo, A. Teshigahara, J. Ceram. Soc. Jpn. 118, 1166 (2010)CrossRef
16.
go back to reference X.H. Xu, H.S. Wu, C.J. Zhang, Z.H. Jin, Thin Solid Films 388, 62–67 (2001)CrossRef X.H. Xu, H.S. Wu, C.J. Zhang, Z.H. Jin, Thin Solid Films 388, 62–67 (2001)CrossRef
17.
go back to reference J.G. Rodriguez-Madrid, G.F. Iriarte, O.A. Williams, F. Calle, Sens. Actuators, A 189, 364–369 (2013)CrossRef J.G. Rodriguez-Madrid, G.F. Iriarte, O.A. Williams, F. Calle, Sens. Actuators, A 189, 364–369 (2013)CrossRef
18.
go back to reference S. Fujii, T. Odawara, H. Yamada, T. Omori, K. Hashimoto, H. Torii, H. Umezawa, S. Shikata, IEEE Trans. Ultrason. Ferroelectr. Freq. Control 60(5), 986–992 (2013)CrossRef S. Fujii, T. Odawara, H. Yamada, T. Omori, K. Hashimoto, H. Torii, H. Umezawa, S. Shikata, IEEE Trans. Ultrason. Ferroelectr. Freq. Control 60(5), 986–992 (2013)CrossRef
19.
go back to reference H. Xiong, J.N. Dai, X. Hui, Y.Y. Fang, M.K. Li et al., J. Alloy. Compd. 554, 104–109 (2013)CrossRef H. Xiong, J.N. Dai, X. Hui, Y.Y. Fang, M.K. Li et al., J. Alloy. Compd. 554, 104–109 (2013)CrossRef
20.
go back to reference K.J. Cheng, S.Y. Cheng, Rare Metal Mater. Eng. 32, 773–776 (2003) K.J. Cheng, S.Y. Cheng, Rare Metal Mater. Eng. 32, 773–776 (2003)
21.
go back to reference J.C. Yang, X.Q. Meng, C.T. Yang, Y. Zhang, Appl. Surf. Sci. 287, 355–358 (2013)CrossRef J.C. Yang, X.Q. Meng, C.T. Yang, Y. Zhang, Appl. Surf. Sci. 287, 355–358 (2013)CrossRef
Metadata
Title
Effects of sputtering atmosphere on the properties of c-plane ScAlN thin films prepared on sapphire substrate
Authors
Yao Zhang
Weixin Zhu
Dong Zhou
Yixi Yang
Chengtao Yang
Publication date
01-01-2015
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 1/2015
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-014-2423-z

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