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Journal of Materials Science: Materials in Electronics
Published in: Journal of Materials Science: Materials in Electronics 6/2011

01-06-2011

Electrical conductivity and viscosity of liquid Sn–Sb–Cu alloys

Authors: Yu. Plevachuk, V. Sklyarchuk, A. Yakymovych, P. Svec, D. Janickovic, E. Illekova

Published in: Journal of Materials Science: Materials in Electronics | Issue 6/2011

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Abstract

Tin-antimony-copper alloys are under intense consideration as favourable lead-free solders for consumer electronics and telecommunications. The electrical conductivity and viscosity studies were carried out in a wide temperature range above the liquidus. A melting-solidification region was investigated by Differential Scanning Calorimetry (DSC). The scaling relations have been proposed. A comparison with data available in literature is given.
previous article Electrical properties of pulsed laser deposited Bi2Zn2/3Nb4/3O7 thin films for high K gate dielectric application
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Metadata
Title
Electrical conductivity and viscosity of liquid Sn–Sb–Cu alloys
Authors
Yu. Plevachuk
V. Sklyarchuk
A. Yakymovych
P. Svec
D. Janickovic
E. Illekova
Publication date
01-06-2011
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 6/2011
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-010-0188-6

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