Skip to main content
EXTENDED SEARCH
Log in
Top

10. Electrically Conductive Adhesives (ECAs)

  • 2017
  • OriginalPaper
  • Chapter
Published in:
Authors
Daniel Lu
C. P. Wong
Published in
Materials for Advanced Packaging
Publisher
Springer International Publishing

Activate our intelligent search to find suitable subject content or patents.

search-config
loading …

Abstract

Conductive adhesives consist of conductive particles and polymeric matrix, and can provide both electrical and mechanical connections. Much advance on conductive adhesive technology has been made over the years. This chapter provides a comprehensive overview on the basic aspects, key applications in electronic packaging, and latest advances of both anisotropically conductive adhesives (ACAs) and isotropically conductive adhesives (ICAs).

Please log in to get access to your license.

Log in Register for free

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Business + Economics & Engineering + Technology"

Online-Abonnement

Springer Professional "Business + Economics & Engineering + Technology" gives you access to:

  • more than 102.000 books
  • more than 537 journals

from the following subject areas:

  • Automotive
  • Construction + Real Estate
  • Business IT + Informatics
  • Electrical Engineering + Electronics
  • Energy + Sustainability
  • Finance + Banking
  • Management + Leadership
  • Marketing + Sales
  • Mechanical Engineering + Materials
  • Insurance + Risk


Secure your knowledge advantage now!

inform now

Springer Professional "Engineering + Technology"

Online-Abonnement

Springer Professional "Engineering + Technology" gives you access to:

  • more than 67.000 books
  • more than 390 journals

from the following specialised fileds:

  • Automotive
  • Business IT + Informatics
  • Construction + Real Estate
  • Electrical Engineering + Electronics
  • Energy + Sustainability
  • Mechanical Engineering + Materials





 

Secure your knowledge advantage now!

inform now
previous chapter New Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips
next chapter Die Attach Adhesives and Films
Title
Electrically Conductive Adhesives (ECAs)
Authors
Daniel Lu
C. P. Wong
Copyright Year
2017
Book
Materials for Advanced Packaging

Print ISBN: 978-3-319-45097-1

Electronic ISBN: 978-3-319-45098-8

Copyright Year: 2017

DOI
https://doi.org/10.1007/978-3-319-45098-8_10
This content is only visible if you are logged in and have the appropriate permissions.