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Journal of Materials Science: Materials in Electronics
Published in: Journal of Materials Science: Materials in Electronics 11/2006

01-11-2006

Electrodeposition of Cu from acidic sulphate solutions in the presence of polyethylene glycol and chloride ions

Authors: B. Bozzini, L. D’Urzo, C. Mele, V. Romanello

Published in: Journal of Materials Science: Materials in Electronics | Issue 11/2006

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Abstract

A surface-enhanced Raman scattering (SERS) spectroelectrochemical investigation has been carried out during Cu electrodeposition from an acidic sulphate solution in the presence of Polyethylene glycol (PEG) and chloride ions. PEG-related bands are clearly visible at the open circuit potential (OCP) and during the electroplating process, showing that the polymer is stably adsorbed on the Cu surface in a wide cathodic potential window. Our experimental range was limitated by the occurrence of fluorescence at potentials more cathodic then  − 200 mV versus Ag/AgCl, indicating the formation of fluorescent species by electrodic reaction. A tentative reactivity scheme for PEG is provided. The co-adsorption of chloride and sulphate species from copper (II) sulphate and sulphuric acid was highlighted as well.
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Metadata
Title
Electrodeposition of Cu from acidic sulphate solutions in the presence of polyethylene glycol and chloride ions
Authors
B. Bozzini
L. D’Urzo
C. Mele
V. Romanello
Publication date
01-11-2006
Publisher
Kluwer Academic Publishers
Published in
Journal of Materials Science: Materials in Electronics / Issue 11/2006
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-006-0044-x

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