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2020 | OriginalPaper | Chapter

Electrothermal Characterization of Double-Sided Cooling Si Power Module

Authors : Sébastien Sanchez, C. Nguyen, Claudia Cadile, Jean-Pierre Fradin, Patrick Tounsi, Jean-Michel Reynes

Published in: ELECTRIMACS 2019

Publisher: Springer International Publishing

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Abstract

This paper presents an electrothermal characterization of a prototype double-sided cooling power module. The junction temperature T j is an important parameter of power devices. Different methods exist for junction temperature measurement. In this work, an electrical method based on temperature sensitive electrical parameter (TSEP) is conducted to estimate the junction temperature of the power module. A 3D thermal model was built to better comprehend thermal behavior within the module. A comparison between simulation and measurement results is performed and analyzed. Results have shown that 3D numerical modeling help understanding several manufacturing defects (soldering, sintering, die defaults, etc.).

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Metadata
Title
Electrothermal Characterization of Double-Sided Cooling Si Power Module
Authors
Sébastien Sanchez
C. Nguyen
Claudia Cadile
Jean-Pierre Fradin
Patrick Tounsi
Jean-Michel Reynes
Copyright Year
2020
DOI
https://doi.org/10.1007/978-3-030-37161-6_5

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