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01-10-2016 | Original Paper | Issue 1/2016

Tribology Letters 1/2016

Enhanced Friction-Reducing Behavior of Stearic Acid Film on the Etched Copper

Journal:
Tribology Letters > Issue 1/2016
Authors:
Yong Wan, Lei Cao, Yankun Yu, Jianguo Gao

Abstract

A simple two-step process was developed to render the low-friction copper surface with longer durability. The copper substrate was firstly etched by immersing it in H2O2/HCl solution to fabricate a CuCl film, while a layer of stearic acid was then deposited on the CuCl film. Scanning electron microscopy, X-ray photoelectron spectroscopy, Fourier transform infrared microscopy and water contact angle measurements were used to analyze the morphological features, the chemical composition and hydrophobicity of freshly prepared specimens, respectively. Moreover, the friction-reducing behavior of the dual-modified copper surface sliding against a steel ball under unlubricating condition was evaluated in tribotester with a ball-on-plate configuration. It is found that the tribological performances of copper substrate are much improved by depositing stearic acid films on the etched copper.

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