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Published in: Journal of Materials Science: Materials in Electronics 7/2016

23-03-2016

Enhancing supercapacitive performance of polyaniline by interfacial copolymerization with melamine

Authors: Hossein Mahdavi, Peyman Khodaei Kahriz, Habib Gholipour Ranjbar, Taieb Shahalizade

Published in: Journal of Materials Science: Materials in Electronics | Issue 7/2016

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Abstract

Polyaniline is a promising pseudo-capacitive material due to its low cost, ease of synthesis and high theoretical capacitance. However its application in commercial supercapacitors due to low cyclic stability was hindered. In order to overcome this deficiency in a facial one step approach, aniline–melamine copolymer (AMC) synthesized through interfacial copolymerization method at two different conditions. Electrochemical characterizations of the products proved that copolymerization of polyaniline with melamine led to a considerable improvement in supercapacitive performance (specific capacitance of 720 F g−1 at 5 mV s−1 and 83 % capacitance retention after 1500 cycles) compared with pure PANI nanofibers obtained from the interfacial polymerization (specific capacitance value of 440 F g−1 at 5 mV s−1 and 30 % capacitance retention after 1250 cycles). Also, copolymer samples with higher melamine content showed better supercapacitive performance (AMC-1 vs. AMC-2).

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Literature
1.
go back to reference P. Sivaraman, S.K. Rath, V.R. Hande, A.P. Thakur, M. Patri, A.B. Samui, Synth. Met. 156, 1057 (2006)CrossRef P. Sivaraman, S.K. Rath, V.R. Hande, A.P. Thakur, M. Patri, A.B. Samui, Synth. Met. 156, 1057 (2006)CrossRef
2.
go back to reference W. Yang, Z. Gao, N. Song, Y. Zhang, Y. Yang, J. Wang, J. Power Sources 272, 915 (2014)CrossRef W. Yang, Z. Gao, N. Song, Y. Zhang, Y. Yang, J. Wang, J. Power Sources 272, 915 (2014)CrossRef
4.
go back to reference Z. Gao, W. Yang, J. Wang, H. Yan, Y. Yao, J. Ma, B. Wang, M. Zhang, L. Liu, Electrochim. Acta 91, 185 (2013)CrossRef Z. Gao, W. Yang, J. Wang, H. Yan, Y. Yao, J. Ma, B. Wang, M. Zhang, L. Liu, Electrochim. Acta 91, 185 (2013)CrossRef
7.
go back to reference H. Liu, B. Xu, M. Jia, M. Zhang, B. Cao, X. Zhao, Y. Wang, Appl. Surf. Sci. 332, 40 (2015)CrossRef H. Liu, B. Xu, M. Jia, M. Zhang, B. Cao, X. Zhao, Y. Wang, Appl. Surf. Sci. 332, 40 (2015)CrossRef
8.
go back to reference A. Kapil, M. Taunk, S. Chand, J. Mater. Sci. Mater. Electron. 21, 399 (2010)CrossRef A. Kapil, M. Taunk, S. Chand, J. Mater. Sci. Mater. Electron. 21, 399 (2010)CrossRef
9.
go back to reference I. Mahmood, I. Ahmad, L. Huizhou, G. Chen, J. Mater. Sci. Mater. Electron. 24, 1181 (2013)CrossRef I. Mahmood, I. Ahmad, L. Huizhou, G. Chen, J. Mater. Sci. Mater. Electron. 24, 1181 (2013)CrossRef
10.
go back to reference Z. Hai, L. Gao, Q. Zhang, H. Xu, D. Cui, Z. Zhang, D. Tsoukalas, J. Tang, S. Yan, C. Xue, Appl. Surf. Sci. 361, 57 (2016)CrossRef Z. Hai, L. Gao, Q. Zhang, H. Xu, D. Cui, Z. Zhang, D. Tsoukalas, J. Tang, S. Yan, C. Xue, Appl. Surf. Sci. 361, 57 (2016)CrossRef
11.
12.
14.
17.
18.
go back to reference E. Raymundo-Piñero, V. Khomenko, E. Frackowiak, F. Béguin, J. Electrochem. Soc. 152, A229 (2005)CrossRef E. Raymundo-Piñero, V. Khomenko, E. Frackowiak, F. Béguin, J. Electrochem. Soc. 152, A229 (2005)CrossRef
19.
go back to reference H.R. Ghenaatian, M.F. Mousavi, S.H. Kazemi, M. Shamsipur, Synth. Met. 159, 1717 (2009)CrossRef H.R. Ghenaatian, M.F. Mousavi, S.H. Kazemi, M. Shamsipur, Synth. Met. 159, 1717 (2009)CrossRef
20.
21.
go back to reference S.R. Sivakkumar, W.J. Kim, J.A. Choi, D.R. MacFarlane, M. Forsyth, D.W. Kim, J. Power Sources 171, 1062 (2007)CrossRef S.R. Sivakkumar, W.J. Kim, J.A. Choi, D.R. MacFarlane, M. Forsyth, D.W. Kim, J. Power Sources 171, 1062 (2007)CrossRef
22.
23.
go back to reference L.J. Sun, X.X. Liu, K.K.T. Lau, L. Chen, W.M. Gu, Electrochim. Acta 53, 3036 (2008)CrossRef L.J. Sun, X.X. Liu, K.K.T. Lau, L. Chen, W.M. Gu, Electrochim. Acta 53, 3036 (2008)CrossRef
24.
go back to reference F. Fusalba, P. Gouerec, D. Villers, D. Belanger, J. Electrochem. Soc. 148, A1 (2001)CrossRef F. Fusalba, P. Gouerec, D. Villers, D. Belanger, J. Electrochem. Soc. 148, A1 (2001)CrossRef
26.
go back to reference M. Kim, S. Cho, J. Song, S. Son, J. Jang, A.C.S. Appl, Mater. Interfaces 4, 4603 (2012)CrossRef M. Kim, S. Cho, J. Song, S. Son, J. Jang, A.C.S. Appl, Mater. Interfaces 4, 4603 (2012)CrossRef
27.
go back to reference K. Rajendra Prasad, N. Munichandraiah, Electrochem. Solid-State Lett. 5, A271 (2002)CrossRef K. Rajendra Prasad, N. Munichandraiah, Electrochem. Solid-State Lett. 5, A271 (2002)CrossRef
28.
go back to reference D. Xu, Q. Xu, K. Wang, J. Chen, Z. Chen, A.C.S. Appl, Mater. Interfaces 6, 200 (2014)CrossRef D. Xu, Q. Xu, K. Wang, J. Chen, Z. Chen, A.C.S. Appl, Mater. Interfaces 6, 200 (2014)CrossRef
30.
go back to reference Z.F. Li, H. Zhang, Q. Liu, L. Sun, L. Stanciu, J. Xie, A.C.S. Appl, Mater. Interfaces 5, 2685 (2013)CrossRef Z.F. Li, H. Zhang, Q. Liu, L. Sun, L. Stanciu, J. Xie, A.C.S. Appl, Mater. Interfaces 5, 2685 (2013)CrossRef
31.
go back to reference H.-P. Cong, X.-C. Ren, P. Wang, S.-H. Yu, Energy Environ. Sci. 6, 1185 (2013)CrossRef H.-P. Cong, X.-C. Ren, P. Wang, S.-H. Yu, Energy Environ. Sci. 6, 1185 (2013)CrossRef
32.
go back to reference Y.Y. Horng, Y.C. Lu, Y.K. Hsu, C.C. Chen, L.C. Chen, K.H. Chen, J. Power Sources 195, 4418 (2010)CrossRef Y.Y. Horng, Y.C. Lu, Y.K. Hsu, C.C. Chen, L.C. Chen, K.H. Chen, J. Power Sources 195, 4418 (2010)CrossRef
33.
go back to reference W. Fan, C. Zhang, W.W. Tjiu, K.P. Pramoda, C. He, T. Liu, A.C.S. Appl, Mater. Interfaces 5, 3382 (2013)CrossRef W. Fan, C. Zhang, W.W. Tjiu, K.P. Pramoda, C. He, T. Liu, A.C.S. Appl, Mater. Interfaces 5, 3382 (2013)CrossRef
34.
35.
go back to reference N.A. Kumar, H.J. Choi, Y.R. Shin, D.W. Chang, L. Dai, J.B. Baek, ACS Nano 6, 1715 (2012)CrossRef N.A. Kumar, H.J. Choi, Y.R. Shin, D.W. Chang, L. Dai, J.B. Baek, ACS Nano 6, 1715 (2012)CrossRef
36.
go back to reference Y. Zhou, Z.Y. Qin, L. Li, Y. Zhang, Y.L. Wei, L.F. Wang, M.F. Zhu, Electrochim. Acta 55, 3904 (2010)CrossRef Y. Zhou, Z.Y. Qin, L. Li, Y. Zhang, Y.L. Wei, L.F. Wang, M.F. Zhu, Electrochim. Acta 55, 3904 (2010)CrossRef
Metadata
Title
Enhancing supercapacitive performance of polyaniline by interfacial copolymerization with melamine
Authors
Hossein Mahdavi
Peyman Khodaei Kahriz
Habib Gholipour Ranjbar
Taieb Shahalizade
Publication date
23-03-2016
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 7/2016
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-016-4715-y

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