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Open Access 30-10-2018 | TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder

Evaluating Creep Deformation in Controlled Microstructures of Sn-3Ag-0.5Cu Solder

Authors: Tianhong Gu, Christopher M. Gourlay, T. Ben Britton

Title: Evaluating Creep Deformation in Controlled Microstructures of Sn-3Ag-0.5Cu Solder
Authors: Tianhong Gu
Christopher M. Gourlay
T. Ben Britton
Publication date: 30-10-2018
Publisher: Springer US
Published in: Journal of Electronic Materials / Issue 1/2019
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI: https://doi.org/10.1007/s11664-018-6744-1