Evolution and Growth Mechanism of Cu2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging | springerprofessional.de

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02-01-2020 | Issue 4/2020

Evolution and Growth Mechanism of Cu₂(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging

Journal:: Journal of Electronic Materials > Issue 4/2020

Authors:: Feifei Tian, Xueyong Pang, Bo Xu, Zhi-Quan Liu

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Title: Evolution and Growth Mechanism of Cu2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging
Authors:: Feifei Tian
Xueyong Pang
Bo Xu
Zhi-Quan Liu
Publication date: 02-01-2020
DOI: https://doi.org/10.1007/s11664-019-07909-w
Publisher: Springer US
Journal: Journal of Electronic Materials
Issue 4/2020
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X

Version: 0.1215.0