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Introduction to 3D Microelectronic Packaging Read chapter Read first chapter

2017 | OriginalPaper | Chapter

15. Fault Isolation and Failure Analysis of 3D Packaging

Authors : Yan Li, Deepak Goyal

Published in: 3D Microelectronic Packaging

Publisher: Springer International Publishing

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Abstract

The high level of functional integration and the complex package architecture in advanced 3D packages pose a significant challenge for conventional Fault Isolation (FI) and Failure analysis (FA) methods. High-resolution nondestructive FI and imaging tools, as well as innovative applications of FA techniques are required to tackle the technical and throughput challenges. In this Chapter, the applications of FI and FA techniques such as Time domain reflectrometry (TDR), Electro Optic Terahertz Pulse Reflectometry (EOTPR), Lock-in Thermography (LIT), Scanning Superconducting Quantum Interference Device (SQUID) Microscopy (SSM), Scanning Acoustic microscopy (SAM), 2D X-ray radiography, 3D X-ray Computed Tomography (CT), laser ablation, Plasma Focused Ion Beam (FIB), Broad-beam Argon Ion Milling, Energy-dispersive X-ray spectroscopy (EDX), X-ray Photoelectron Spectroscopy (XPS), Time-of-Flight Secondary Ion Mass Spectrometry (TOF-SIMS), and Electron Backscatter Diffraction (EBSD) to 3D packages are reviewed along with the key FI and FA challenges. 3D package FA Strategies of building up efficient FI-FA flow and in-depth root cause studies to provide solution paths are discussed and demonstrated by case studies.

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previous chapter Interconnect Quality and Reliability of 3D Packaging
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Metadata
Title
Fault Isolation and Failure Analysis of 3D Packaging
Authors
Yan Li
Deepak Goyal
Copyright Year
2017
Book
3D Microelectronic Packaging

Print ISBN: 978-3-319-44584-7

Electronic ISBN: 978-3-319-44586-1

Copyright Year: 2017

DOI
https://doi.org/10.1007/978-3-319-44586-1_15