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Published in:
Overview of MEMS Packaging Technologies Read chapter Read first chapter

2018 | OriginalPaper | Chapter

5. FEM Modeling of Debonding of Transfer Packaging

Author : Seonho Seok

Published in: Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering

Publisher: Springer International Publishing

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Abstract

As already demonstrated previously, the critical step of the transfer packaging is debonding of the temporary carrier substrate. Mechanical modeling is one of solution for such critical step to understand the exact mechanism governing the failure mode of the transfer packaging. Therefore, this chapter will explain the way how to establish an appropriate FEM model to simulate the debonding process occurring in the interface between Si carrier wafer and transferred cap. The modeling will be useful to comprehend the behavior of the transferred cap in terms of deformation and stress during the debonding process.

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Metadata
Title
FEM Modeling of Debonding of Transfer Packaging
Author
Seonho Seok
Copyright Year
2018
Book
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering

Print ISBN: 978-3-319-77871-6

Electronic ISBN: 978-3-319-77872-3

Copyright Year: 2018

DOI
https://doi.org/10.1007/978-3-319-77872-3_5

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