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2015 | OriginalPaper | Chapter

11. Fiber Optic Modules

Author : Ulrich H. P. Fischer-Hirchert

Published in: Photonic Packaging Sourcebook

Publisher: Springer Berlin Heidelberg

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Abstract

In this chapter, different module structures are presented which are applied in commercial modules. Usually, module assemblies are classified into the following categories: (1) transmitter modules (laser) with and without cooling; (2) receiver module (photodiode); (3) mixed modules (transmitter or receiver); (4) multi-fiber modules (arrays). For each category, an example is shown in more detail in the following. Previously, however, it is necessary to provide some explanation of the used coupling method.

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Eckhardt, T., Fischer, U.H.P., Ziegler, R.: DIL-size reusable modules with up to 50 GHz modulation bandwidth for optical communications systems. In: Faulkner, D.W., Harmer, A.L. (eds.) WDM and Photonic Networks, pp. 181–184. IOS Press, Netherlands (2000)

Ehlers, H., Schlak, M., Fischer, U.H.P.: Multi-fiber-chip-coupling modules for monolithically integrated Mach-Zehnder interferometers for TDM/WDM communication systems. In: Conference on Optical Fiber Communication. Technical Digest Series, pp. WDD66/1–WDD66/3, Anaheim, CA (2001)

Fischer, U.H.P., Zech, S., Peters, K.: Transmitter modules with reusable fiber-chip coupling method for optical communications systems. http://www.eetimes.com/design/communications-design/4017993/A-Reusable-Fiber-Chip-Coupling-Method-for-Optical-Communication-Transmitter-Modules (2001)

Fischer, U.H.P.: Packaging of OEICs with tapered fibers for optical communications systems with up to 45 GHz modulation bandwidth. In: Proceedings of the European Conference on Networks and Optical Communications: Broadband Access and Technology, pp. 296–300 (1999)

Hamacher, M., et al.: Monolithic integration of lasers, photodiodes, waveguides and spot size converters on GaInAsP/InP for photonic applications. In: InP and Related Materials Conference (IPRM 2000), paper MA1.3, pp. 21–24, Williamsburg USA (2000)

ITU-T G652: Transmission systems and media. Digital systems and networks, Transmission media characteristics—optical fibre cables (2000)

Ladany, I.: Laser to single-mode fiber coupling in the laboratory. Appl. Opt. 32, 3233–3236 (1993)CrossRef

Peters, K.: DE 195 36 185.7 (1994a)

Peters, K.: DE 195 36 173.3 (1994b)

Fischer, UHP: Laser Micro Welding for Fiber-chip-coupling Modules with Lensed Fiber Ends for Photonic Communication Systems. 14th International Scientific Conference Mittweida, 8–11 November 2000

Rohde, D., et al.: Optic/millimeter-wave converter for 60 GHz radio-over-fiber systems. In: MIOP ́97, Conference Proceedings, pp. 311–315 (1997)

Rosin, T., Bornholdt, C., Hoffmann, D., Burghardt, R., Bornhold, C.: Opto-electronic packaging for broadband high speed (40 Gb/s) optical demultiplexer chip. In: LEOS 98, pp. 123–126, Orlando, Florida (1998)

Tekin, T., Schlak, M., Brinker, W., Maul, B., Molt, R.: Monolithically integrated MZI comprising band gap shifted SOAs: a new switching scheme for generic all-optical signal processing. In: European Conference on Optical Communication (ECOC), pp. 123–124, München (2000)

Umbach, A., Trommer, D., Siefke, A., Unterbörsch, G.: 50 GHz operation of waveguide integrated photodiode at 1.55 μm. In: Proceedings of the 21st ECOC, vol. 17, p. 1075, Brussels, Belgien, 21 Sept 1995

Title: Fiber Optic Modules
Author: Ulrich H. P. Fischer-Hirchert
Publisher: Springer Berlin Heidelberg
Book: Photonic Packaging Sourcebook
Print ISBN: 978-3-642-25375-1

Electronic ISBN: 978-3-642-25376-8

Copyright Year: 2015
DOI: https://doi.org/10.1007/978-3-642-25376-8_11