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Published in:
2022 | OriginalPaper | Chapter
16. Finite Element Solution of a Solder Filling Problem with Contact Angle Condition
Authors : Atsushi Suzuki, Hiroshi Ogawa
Published in: Advances in Computational Methods and Technologies in Aeronautics and Industry
Publisher: Springer International Publishing
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Abstract
A finite element computation of a solder filling problem with contact angle condition and volume constraint is shown as an application to solve industrial problem where amount of solder needs to be optimized during manufacturing process. The solder that fills the gap between two plates is found through incremental process of the filling volume by solving a nonlinear elliptic problem as an extremal of a total free energy with a double well potential, which enforces separation of solder and air regions. The nonlinear elliptic partial differential equation is discretized by P2 finite element and whose solution is obtained by combination of a gradient flow solver and a stationary Newton iteration solver. Several open source software for numerical computation are used, for example, finite element computation is carried out by ‘FreeFEM’, mesh generation by ‘Gmsh’, mesh adaptation by ‘mmg3d’, and parallel computation on distributed memory environment by ‘HPDDM’.