2018 | OriginalPaper | Chapter
31. Flip-Chip Packaging for Nanoscale Silicon Logic Devices: Challenges and Opportunities
Authors : Debendra Mallik, Ravi Mahajan, Nachiket Raravikar, Kaladhar Radhakrishnan, Kemal Aygun, Bob Sankman
Published in: Nanopackaging
Publisher: Springer International Publishing
Activate our intelligent search to find suitable subject content or patents.
Select sections of text to find matching patents with Artificial Intelligence. powered by
Select sections of text to find additional relevant content using AI-assisted search. powered by