Electric properties and microhardness of the Cu–5.9 at % Pd alloy are studied. These characteristics are compared with those of pure copper and Cu–8 at % Pd alloy. The results obtained are discussed using literature data on the properties of compositions close to the stoichiometric Cu3Pd alloy. Dependences of the electrical resistivity of low-alloyed Cu–Pd alloys on the true strain and quenching temperature are plotted. An anomalous decrease in the electrical resistivity of the studied alloys was found to result from both plastic deformation and increase in the quenching temperature. Annealing in a temperature range of 200–300°С was found to lead to an anomalous increase in the microhardness and electrical resistivity. The anomalies found are explained from the viewpoint of the formation of short-range atomic order upon quenching of the low-alloyed Cu–Pd alloys.