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Published in:
Patent Issues of Fan-Out Wafer-Level Packaging Read chapter Read first chapter

2018 | OriginalPaper | Chapter

8. FOWLP: PoP

Author : John H. Lau

Published in: Fan-Out Wafer-Level Packaging

Publisher: Springer Singapore

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Abstract

Package-on-package (PoP) has been used for housing the application processor (AP) chipset for a few years as shown in Fig. 2.​17. Usually, the top package is used to house the mobile memory and the bottom package is used to house the AP. STATS ChipPAC proposed a PoP for the AP chipset with the FOWLP technology (Eslampour et al in IEEE/ECTC proceedings, 1946–1950, [1]; Yoon et al. in Proceedings of IEEE/ECTC, 1250–1254, [2]).

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previous chapter FOWLP: Chip-Last or RDL-First
next chapter Fan-Out Panel-Level Packaging (FOPLP)
Literature
1.
Eslampour, H., S. Lee, S. Park, T. Lee, I. Yoon, and Y. Kim. 2010. Comparison of Advanced PoP Package Configurations. In IEEE/ECTC Proceedings, 2010, 1946–1950.
2.
Yoon, S., J. Caparas, Y. Lin, and P. Marimuthu. 2012. Advanced Low Profile PoP Solution with Embedded Wafer Level PoP (eWLB-PoP) Technology. In Proceedings of IEEE/ECTC, 2012, 1250–1254.
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Lau, J.H., N. Fan, M. Li. 2016. Design, Material, Process, and Equipment of Embedded Fan-Out Wafer/Panel-Level Packaging. Chip Scale Review 20: 38–44.
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13.
Lau, J.H., M. Li, N. Fan, E. Kuah, Z. Li, K. Tan, T. Chen, et al. 2017. Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip With Multiple Redistribution-Layers (RDLs). In IMAPS Proceedings, October 2017, 576–583. Also, IMAPS Transactions, Journal of Microelectronics and Electronic Packaging 14 (4), 123–131 (October 2017).
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Li, M., Q. Li, J.H. Lau, N. Fan, E. Kuah, K. Wu, et al. 2017. Characterizations of Fan-Out Wafer-Level Packaging. In IMAPS Proceedings, October 2017, 557–562.
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Hua, X., H. Xu, Z. Li Zhang, D. Chen, K. Tan, J.H. Lau, et al. 2017. Development of Chip-First and Die-Up Fan-Out Wafer-Level Packaging. In IEEE/EPTC Proceedings, December 2017, S23_1-6.
16.
Lau, J.H. 2015. Patent Issues of Fan-Out Wafer/Panel-Level Packaging. Chip Scale Review 19: 42–46.
Metadata
Title
FOWLP: PoP
Author
John H. Lau
Copyright Year
2018
Publisher
Springer Singapore
Book
Fan-Out Wafer-Level Packaging

Print ISBN: 978-981-10-8883-4

Electronic ISBN: 978-981-10-8884-1

Copyright Year: 2018

DOI
https://doi.org/10.1007/978-981-10-8884-1_8