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Published in:

2006 | OriginalPaper | Chapter

Fracture Analysis on Popcorning of Plastic Packages During Solder Reflow

Authors : S. W. R. Lee, D. C. Y. Lau

Published in: Fracture of Nano and Engineering Materials and Structures

Publisher: Springer Netherlands

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Moisture-induced cracking during the solder reflow process is a critical reliability problem for plastic packages. Figure 1 shows the schematic diagram of a plastic ball grid array (PBGA) package with either a crack at the die attach or at the interface between solder mask and copper. These types of internal cracking are mainly resulted from a combination of thermal expansion mismatch of the package and the moisture-vaporized pressure acting on the crack surface inside the package. Such a phenomenon is known as the “popcorning” problem (Kuo

et al.

[

]).

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