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Metallurgical and Materials Transactions A
Published in: Metallurgical and Materials Transactions A 12/2020

13-10-2020

Gallium Liquid Metal Embrittlement of Tin-based Solder Alloys

Authors: Elodie Nguena, David Danovitch, Julien Sylvestre, Richard Langlois, Serge Martel

Published in: Metallurgical and Materials Transactions A | Issue 12/2020

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Abstract

We report on the embrittlement of tin (Sn)-based solder by liquid gallium (Ga). Exposure to liquid Ga results in a degradation of the intrinsic mechanical properties of the solder due to its ductile-to-brittle transition. Important changes in the solder microstructure accompany this degradation and are predominantly associated with a spontaneous recrystallization of Sn during Ga diffusion into the solder. A detailed investigation of the solder microstructure evolution identifies the recrystallization process as a Continuous Static Recrystallization (C-SRX). Taking into account mechanisms of atomic transport as well as the creation and propagation of defects, a novel liquid metal embrittlement (LME) model is herein proposed, namely the Diffusion-Induced Recrystallization Evolution (DIRE) model.
previous article Mechanical Behavior and Strengthening Mechanisms in Precipitation-Strengthened Aluminum Alloy with Gradient Structure Induced by Sliding Friction Treatment
next article Microstructure and Mechanical Properties of Ti-6Al-4V Alloy/Interstitial Free Steel Joint Diffusion Bonded with Application of Copper and Nickel Interlayers

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Metadata
Title
Gallium Liquid Metal Embrittlement of Tin-based Solder Alloys
Authors
Elodie Nguena
David Danovitch
Julien Sylvestre
Richard Langlois
Serge Martel
Publication date
13-10-2020
Publisher
Springer US
Published in
Metallurgical and Materials Transactions A / Issue 12/2020
Print ISSN: 1073-5623
Electronic ISSN: 1543-1940
DOI
https://doi.org/10.1007/s11661-020-06041-3

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