High-performance low-cost silver-coated copper paste for silicon heterojunction solar cells

This article explores a groundbreaking method for creating high-performance, low-cost silver-coated copper paste for silicon heterojunction solar cells. The study focuses on overcoming the challenges of conventional synthesis methods, which often result in non-uniform coatings and copper agglomeration. By employing a chloride-ion-assisted chemical reduction strategy, the researchers achieve exceptional copper particle separation and uniform silver deposition. The resulting silver-coated copper microparticles exhibit complete oxidation resistance below 300°C and minimal resistivity of 1.90 mΩ. The article delves into the experimental process, including material preparation, synthesis of core-shell microparticles, and paste formulation. It also provides a detailed analysis of the material's phases, microstructure, and stability, supported by advanced characterization techniques such as XRD, SEM, and XPS. The performance of the Cu@Ag pastes is thoroughly evaluated, including electrical properties, printing performance, and microstructural analysis. The study concludes with a comparison to commercial silver pastes, highlighting the economic and environmental benefits of the new method. This innovative approach offers a practical pathway to reducing silver consumption by 70% while maintaining performance parity, paving the way for more sustainable and cost-effective solar cell manufacturing.