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adhesion ADHESIVES + SEALANTS

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01-03-2018 | Cover Story

Hot Spot Solution

Published in: adhesion ADHESIVES + SEALANTS | Issue 1/2018

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The trend is obvious: Whether in the automotive industry, in communication and power electronics or in the area of eMobility — new appliances and products become progressively smaller. At the same time, more and more functions should be packed into minimal space. But how can electronic components, assemblies and systems be downsized without overheating, losing performance or even cause malfunctions? …

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Title: Hot Spot Solution
Publication date: 01-03-2018
Published in: adhesion ADHESIVES + SEALANTS / Issue 1/2018
Print ISSN: 2192-2624
Electronic ISSN: 2195-6545
DOI: https://doi.org/10.1007/s35784-018-0004-x

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