Abstract
The rapid development of thermal imaging technology requires a radical improvement in the technology of infrared photodetectors in the mid wave (MWIR, 3–5 μm) and long wave (LWIR, 8–14 μm) regions of the infrared (IR) range. Today, there is an urgent need to develop MWIR and LWIR array photodetectors of the third generation, which are subject to increased requirements for photosensitive elements, in particular, for operating temperatures, weight, dimensions, and power consumption.
One of the main ways to improve the performance of such photosensitive device structures is to increase the operating temperature of cooled photosensitive layer in the photodetectors without losing temperature sensitivity and infrared image quality. This trend is directly related to the development and implementation of new photosensitive semiconductor structures that provide low dark currents and, as a result, low intrinsic noise. This is achieved through the creation of semiconductor heterostructures by epitaxial methods. Currently, work on the creation of high operating temperature focal plane array (HOT FPA) is being actively carried out by leading manufacturers of optoelectronic equipment.
Another way to improve the performance of such photosensitive device structures is the use of so-called unipolar xBn barrier structures, where x is a contact semiconductor layer of n- or p-type conductivity, B is a barrier layer, and n is an absorbing layer of n-type of conductivity.
At present, research and development of nBn structures for FPAs are carried out both on the basis of III-V and II-VI materials. In the case of II-VI materials, a semiconducting HgCdTe solid solution is used. From a fundamental point of view, HgCdTe is an ideal material for creating IR detectors.
This chapter is review the latest advances in the development and fabrication of unipolar barrier structures based on HgCdTe.