Skip to main content
Top
Published in: Journal of Materials Science: Materials in Electronics 2/2019

26-11-2018

Impact of molarity on structural, optical, morphological and electrical properties of copper oxide thin films prepared by cost effective jet nebulizer spray pyrolysis technique

Authors: V. Jagadeesan, Venkat Subramaniam

Published in: Journal of Materials Science: Materials in Electronics | Issue 2/2019

Log in

Activate our intelligent search to find suitable subject content or patents.

search-config
loading …

Abstract

Copper oxide (CuO) thin films were prepared by simple and cost effective jet nebulizer spray pyrolysis method with different molar concentration 0.1, 0.2 and 0.3 M named as J1, J2 and J3 respectively. The impact of molarity on structural, optical, morphological and electrical of properties of CuO thin film was studied. The structural studies confirmed that the prepared CuO thin films are monoclinic crystal structure matching with standard JCPDS card No. 89-5899. The thickness of CuO thin films determined by surface profilometer found to be increasing while increasing molar concentration. The optical energy band gaps were determined using Kulbelka–Munk (K–M) method are found to be 2.1 eV, 1.9 eV and 1.8 eV for J1, J2 and J3 respectively. The morphological properties and chemical composition of CuO thin film were investigated via field-emission scanning electron microscope (FESEM) and energy dispersive analysis from X-ray spectroscopy (EDAX). According to FESEM all the prepared CuO thin films are well covered and adhered to the substrate with good homogeneity and EDAX spectra confirms the presence of copper (Cu) and oxygen (O). The adhesion strength has been determined in accordance with test method D3330 using scotch tape test. The electrical conductivity of CuO thin films were investigated. The maximum conductivity value of the CuO thin film is observed 2.75 × 10−8 S/cm.

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Springer Professional "Wirtschaft"

Online-Abonnement

Mit Springer Professional "Wirtschaft" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 340 Zeitschriften

aus folgenden Fachgebieten:

  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Versicherung + Risiko




Jetzt Wissensvorsprung sichern!

Literature
2.
go back to reference V. Saravanakannan, T. Radhakrishnan, Int. J. ChemTech. Res. 6, 306–310 (2014) V. Saravanakannan, T. Radhakrishnan, Int. J. ChemTech. Res. 6, 306–310 (2014)
3.
4.
go back to reference S.B.B. Wang, C.H.H. Hsiao, S.J.J. Chang, K.T.T. Lam et al., Sens. Actuators A 171, 207–211 (2011)CrossRef S.B.B. Wang, C.H.H. Hsiao, S.J.J. Chang, K.T.T. Lam et al., Sens. Actuators A 171, 207–211 (2011)CrossRef
6.
go back to reference M.M. Rahman, A.J. Saleh Ahammad, J.-H. Jin, S.J. Ahn, J.-J. Lee, Sensors 10, 4855–4886 (2010)CrossRef M.M. Rahman, A.J. Saleh Ahammad, J.-H. Jin, S.J. Ahn, J.-J. Lee, Sensors 10, 4855–4886 (2010)CrossRef
7.
go back to reference X. Zhang, W. Shi, J. Zhu, D. Kharistal, W. Zhao, B. Lalia, et al., ACS Nano 5, 2013–2019 (2011)CrossRef X. Zhang, W. Shi, J. Zhu, D. Kharistal, W. Zhao, B. Lalia, et al., ACS Nano 5, 2013–2019 (2011)CrossRef
8.
go back to reference C. Rossi, K. Zhang, D. Esteve, P. Alphonse, P. Tailhades, C. Vahlas, J. Microelectromech. Syst. 16, 919–931 (2007)CrossRef C. Rossi, K. Zhang, D. Esteve, P. Alphonse, P. Tailhades, C. Vahlas, J. Microelectromech. Syst. 16, 919–931 (2007)CrossRef
9.
go back to reference P. Markworth, X. Liu, J. Dai, W. Fan, T.J. Marks, R.P. Chang, J. Mater. Res. 16, 2408–2414 (2001)CrossRef P. Markworth, X. Liu, J. Dai, W. Fan, T.J. Marks, R.P. Chang, J. Mater. Res. 16, 2408–2414 (2001)CrossRef
10.
go back to reference T. Mahalingam, J. Chitra, J. Chu, S. Velumani, P. Sebastian, Sol. Energy Mater. Sol. Cells 88, 209–216 (2005)CrossRef T. Mahalingam, J. Chitra, J. Chu, S. Velumani, P. Sebastian, Sol. Energy Mater. Sol. Cells 88, 209–216 (2005)CrossRef
11.
go back to reference K. Mageshwari, R. Sathyamoorthy, Mater. Sci. Semicond. Process. 16(2), 337–343 (2013)CrossRef K. Mageshwari, R. Sathyamoorthy, Mater. Sci. Semicond. Process. 16(2), 337–343 (2013)CrossRef
12.
go back to reference A. Oral, E. Menşur, M. Aslan, E. Başaran, Mater. Chem. Phys. 83, 140–144 (2004)CrossRef A. Oral, E. Menşur, M. Aslan, E. Başaran, Mater. Chem. Phys. 83, 140–144 (2004)CrossRef
13.
go back to reference A. Ogwu, T. Darma, E. Bouquerel, J. Achiev. Mater. Manuf. Eng. 24, 172–177 (2007) A. Ogwu, T. Darma, E. Bouquerel, J. Achiev. Mater. Manuf. Eng. 24, 172–177 (2007)
14.
go back to reference V. Saravanan, P. Shankar, G.K. Mani, J.B.B. Rayappan, J. Anal. Appl. Pyrol. 111, 272–277 (2015)CrossRef V. Saravanan, P. Shankar, G.K. Mani, J.B.B. Rayappan, J. Anal. Appl. Pyrol. 111, 272–277 (2015)CrossRef
15.
16.
go back to reference R. Mariappan, V. Ponnuswamy, R. Suresh, P. Suresh, A. Chandra Bose, M. Ragavendar, J. Alloys Compd. 582, 387–391 (2014)CrossRef R. Mariappan, V. Ponnuswamy, R. Suresh, P. Suresh, A. Chandra Bose, M. Ragavendar, J. Alloys Compd. 582, 387–391 (2014)CrossRef
17.
go back to reference C.R. Dhas, A. Dinu, A.J. Christy, K. Jeyadheepan, A.M.E. Raj, C. Sanjeeviraja, Asian J. Appl. Sci. 7, 671–684 (2017)CrossRef C.R. Dhas, A. Dinu, A.J. Christy, K. Jeyadheepan, A.M.E. Raj, C. Sanjeeviraja, Asian J. Appl. Sci. 7, 671–684 (2017)CrossRef
18.
go back to reference K. Ravichandran, A. Manivasaham, K. Subha, A. Chandrabose, R. Mariappan, Surf. Interfaces 1–3, 13–20 (2016)CrossRef K. Ravichandran, A. Manivasaham, K. Subha, A. Chandrabose, R. Mariappan, Surf. Interfaces 1–3, 13–20 (2016)CrossRef
19.
go back to reference R. David Prabu, S. Valanarasu, V. Ganesh, M. Shkir, S. AlFaify, A. Kathalingam, S.R. Srikumare, R. Chandramohan, Mater. Sci. Semicond. Process. 74, 129–135 (2018)CrossRef R. David Prabu, S. Valanarasu, V. Ganesh, M. Shkir, S. AlFaify, A. Kathalingam, S.R. Srikumare, R. Chandramohan, Mater. Sci. Semicond. Process. 74, 129–135 (2018)CrossRef
20.
go back to reference M. Lamri Zeggar, F. Bourfaa, A. Adjimi, F. Boutbakh, M.S. Aida, N. Attaf, Int. J. Math. Comput. Phys. Electr. Comput. Eng. 9, 610–613 (2015) M. Lamri Zeggar, F. Bourfaa, A. Adjimi, F. Boutbakh, M.S. Aida, N. Attaf, Int. J. Math. Comput. Phys. Electr. Comput. Eng. 9, 610–613 (2015)
23.
go back to reference C. Ravi Dhas, D. Alexander, A.J. Christy, A. Jeyadheepan, A. Moses, E. Raj, S. Raja, Asian J. Appl. Sci. 7(8), 671–684 (2014)CrossRef C. Ravi Dhas, D. Alexander, A.J. Christy, A. Jeyadheepan, A. Moses, E. Raj, S. Raja, Asian J. Appl. Sci. 7(8), 671–684 (2014)CrossRef
24.
go back to reference G. Korotcenkov, V. Brinzari, A. Cerneavschi, M. Ivanov, V. Golovanov, A. Cornet, J. Morante, A. Cabot, J. Arbiol, Thin Sol. Films 460, 315–323 (2004)CrossRef G. Korotcenkov, V. Brinzari, A. Cerneavschi, M. Ivanov, V. Golovanov, A. Cornet, J. Morante, A. Cabot, J. Arbiol, Thin Sol. Films 460, 315–323 (2004)CrossRef
25.
go back to reference A.H. Jayatissa, K. Guo, A.C. Jayasuriya, Appl. Surf. Sci. 255, 9474–9479 (2009)CrossRef A.H. Jayatissa, K. Guo, A.C. Jayasuriya, Appl. Surf. Sci. 255, 9474–9479 (2009)CrossRef
26.
go back to reference P. Kulbelka, F. Munk, Z. Tech. Phys. 12, 593 (1931) P. Kulbelka, F. Munk, Z. Tech. Phys. 12, 593 (1931)
28.
go back to reference M. Balaji, J. Chandrasekaran, M. Raja, Mater. Sci. Semicond. Process. 43, 104 (2016)CrossRef M. Balaji, J. Chandrasekaran, M. Raja, Mater. Sci. Semicond. Process. 43, 104 (2016)CrossRef
29.
go back to reference P. Venkateswari, P. Thirunavukkarasu, M. Ramamurthy, M. Balaji, J. Chandrasekaran, Optik 140, 476–484 (2017)CrossRef P. Venkateswari, P. Thirunavukkarasu, M. Ramamurthy, M. Balaji, J. Chandrasekaran, Optik 140, 476–484 (2017)CrossRef
Metadata
Title
Impact of molarity on structural, optical, morphological and electrical properties of copper oxide thin films prepared by cost effective jet nebulizer spray pyrolysis technique
Authors
V. Jagadeesan
Venkat Subramaniam
Publication date
26-11-2018
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 2/2019
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-018-0428-8

Other articles of this Issue 2/2019

Journal of Materials Science: Materials in Electronics 2/2019 Go to the issue