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Published in: Journal of Materials Science 11/2011

01-06-2011

Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu

Authors: Chukwudi Okoro, Riet Labie, Kris Vanstreels, Alexis Franquet, Mario Gonzalez, Bart Vandevelde, Eric Beyne, Dirk Vandepitte, Bert Verlinden

Published in: Journal of Materials Science | Issue 11/2011

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Abstract

In this study, the role of electrodeposition chemistry on thermo-mechanical behavior of different Cu-films is examined. For this study, three different Cu electrodeposition chemistries were analyzed using Time-of-Flight Secondary Ion Mass Spectroscopy (TOF-SIMS), Focused Ion Beam (FIB), Laser Scanning method, Electron Backscattered Diffraction, and the Nano-indentation techniques. It is found that the level of impurity in Cu-films, resulting from the used electrodeposition additives, has a significant impact on their microstructural and thermo-mechanical behavior. Cu-films having high impurity content showed residual stress levels that are three times higher than the less impure Cu-films. This implies that the use of such impure electrodeposition chemistry for the filling of TSVs will result in high residual stresses in the Cu–TSV, thus inducing higher stresses in Si, which could be a reliability concern. Therefore, the choice of the used electrodeposition chemistry for the filling of TSVs should not be limited only to the achievement of a void free Cu–TSV, as consideration ought to be given to their thermo-mechanical response.

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Metadata
Title
Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu
Authors
Chukwudi Okoro
Riet Labie
Kris Vanstreels
Alexis Franquet
Mario Gonzalez
Bart Vandevelde
Eric Beyne
Dirk Vandepitte
Bert Verlinden
Publication date
01-06-2011
Publisher
Springer US
Published in
Journal of Materials Science / Issue 11/2011
Print ISSN: 0022-2461
Electronic ISSN: 1573-4803
DOI
https://doi.org/10.1007/s10853-011-5308-z

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