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Journal of Materials Science: Materials in Electronics

Increasing mechanical strength and refining grains of Cu-core solder joints with pressurized bonding

  • 12-11-2020
Published in:
Authors
Rui-Wen Song
Collin Jordon Fleshman
Zih-You Wu
Su-Yueh Tsai
Jenq-Gong Duh
Published in
Journal of Materials Science: Materials in Electronics | Issue 24/2020

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Abstract

For the advanced 3D-IC or 3D-packaging application, Cu-core solder joint is already a high reliability option for high power device and 3D packaging. However, with the harsher requirement for mechanical and electromigration reliability, it is imperative to further strengthen the solder joints. A method of pressurized bonding is proposed in this study to alter and improve the architecture configuration and grain distribution of the Cu-core solder joints. The correlation of strengthening process and microstructure was revealed by electron microscopy, elemental quantification, and grain analysis. Pressurized bonding results in a refined grain distribution, increased shear strength, and possibly stronger resistance to electromigration.

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Title
Increasing mechanical strength and refining grains of Cu-core solder joints with pressurized bonding
Authors
Rui-Wen Song
Collin Jordon Fleshman
Zih-You Wu
Su-Yueh Tsai
Jenq-Gong Duh
Publication date
12-11-2020
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 24/2020
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-020-04824-3
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