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Journal of Materials Science: Materials in Electronics

Influence of different contents of Ag nanoparticles on microstructure and properties of Sn58Bi/Cu solder joint

  • 01-12-2025
Published in:
Authors
Wenhao Wang
Lei Sun
Peng He
Minghe Chen
Bingyang Guo
Published in
Journal of Materials Science: Materials in Electronics | Issue 34/2025

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Abstract

This study delves into the impact of different concentrations of Ag nanoparticles on the microstructure and properties of Sn58Bi/Cu solder joints. The research highlights the refinement of microstructure, suppression of interfacial IMC layer growth, and enhancement of mechanical properties such as shear strength and wettability. With the addition of 1.0 wt.% Ag nanoparticles, the solder joint exhibits optimal properties, including a 9.4% improvement in shear strength and a 9.1% increase in spreading area. The study also explores the mechanisms behind these improvements, such as the formation of fine Ag3Sn particles and the adsorption of Ag nanoparticles at the interface. The findings suggest that Ag nanoparticles can significantly enhance the performance of Sn58Bi/Cu solder joints, making them more reliable for low-temperature electronic packaging applications.
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Title
Influence of different contents of Ag nanoparticles on microstructure and properties of Sn58Bi/Cu solder joint
Authors
Wenhao Wang
Lei Sun
Peng He
Minghe Chen
Bingyang Guo
Publication date
01-12-2025
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 34/2025
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-025-16301-w
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