Influence of Firing Temperature and Atmospheric Conditions on Processing of Direct Bond Copper (DBC)

Direct bond copper (DBC), also called the gas-metal eutectic bonding method, is an important substrate material commonly used for thermal and electrical management in power modules. Developed almost 40 years ago by General Electric, there is wide use of this structure when there is a need of a substrate with high current-carrying and high thermal conductive abilities. The components of DBC are a ceramic (usually aluminum oxide (Al₂O₃) also called alumina) and a bond piece of copper on one or both sides. This copper is strongly bond to the alumina giving strong adhesion and combining benefits from both materials. This paper will give a summary of DBC technology and will discuss the role that furnace temperature and atmosphere perform during processing.