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26-06-2019

Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process

Authors: Fu-an Hua, Hong-wu Song, Tao Sun, Jian-ping Li

Published in: Metals and Materials International | Issue 3/2020

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Abstract

A model based on inter-diffusion theory was established to predict growth kinetics of the intermetallic compounds (IMCs) formed in roll bonded Al/Cu sheets during annealing process. The model can give good prediction of both IMC layers growth kinetics and element concentration distribution at the interface of roll bonded Cu/Al sheets with different thickness under different annealing conditions with certain roll reduction range. It is revealed that the calculated results of the proposed model are depended on the inter-diffusion coefficient of each components, which could be related to the interface bonding state, i.e., bonding methods or rolling reductions for roll bonding. And there was big difference in inter-diffusion coefficient of Al and Cu matrix under different bonding state, while the inter-diffusion coefficient of IMCs changed slightly.

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Metadata
Title
Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process
Authors
Fu-an Hua
Hong-wu Song
Tao Sun
Jian-ping Li
Publication date
26-06-2019
Publisher
The Korean Institute of Metals and Materials
Published in
Metals and Materials International / Issue 3/2020
Print ISSN: 1598-9623
Electronic ISSN: 2005-4149
DOI
https://doi.org/10.1007/s12540-019-00333-z

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