INTER-Layer: A Layered Approach for IoT Platform Interoperability

2021
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Authors: Andreu Belsa; Alejandro Fornes-Leal; Clara I. Valero; Eneko Olivares; Jara Suárez de Puga; Fernando Boronat; Flavio Fuart
Published in: Interoperability of Heterogeneous IoT Platforms
Publisher: Springer International Publishing

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Abstract

The chapter introduces INTER-Layer, a layered approach for achieving interoperability among IoT platforms. It addresses the lack of interoperability in the IoT ecosystem, which hinders the integration of diverse devices and platforms. The solution is designed to provide seamless inclusion of new IoT devices, support for smart object mobility, and a common interpretation of data across different platforms. The chapter outlines the architecture and components of INTER-Layer, including device-to-device, network-to-network, middleware-to-middleware, and application and services-to-application and services interoperability solutions. It also highlights specific use cases and implementations, showcasing the practical applications of the INTER-Layer approach. The chapter concludes by summarizing the main products derived from each layer and the overall benefits of the INTER-Layer solution.

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previous chapter INTER-IoT Architecture for Platform Interoperability

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Title: INTER-Layer: A Layered Approach for IoT Platform Interoperability
Authors: Andreu Belsa
Alejandro Fornes-Leal
Clara I. Valero
Eneko Olivares
Jara Suárez de Puga
Fernando Boronat
Flavio Fuart
Publisher: Springer International Publishing
Book: Interoperability of Heterogeneous IoT Platforms
Print ISBN: 978-3-030-82445-7

Electronic ISBN: 978-3-030-82446-4

Copyright Year: 2021
DOI: https://doi.org/10.1007/978-3-030-82446-4_4

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