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Journal of Materials Engineering and Performance

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01-12-2015

Interfacial Reaction and Shear Strength of SnAgCu/Ni/Bi₂Te₃-Based TE Materials During Aging

Authors: Hongyang Jing, Yuan Li, Lianyong Xu, Yongdian Han, Guoquan Lu, Hao Zhang

Published in: Journal of Materials Engineering and Performance | Issue 12/2015

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Abstract

As a diffusion barrier layer, Ni is widely applied in power electronics packaging, especially in thermoelectric devices. This paper presents the variation of Ni diffusion barrier layer during aging and failure mechanisms of thermoelectric device joints. The thermoelectric joint consists of Sn96.5Ag3.0Cu0.5 (SAC305) solder and Bi₂Te₃-based thermoelectric materials such as Bi_0.5Sb_1.5Te₃ and Bi_1.8Sb_0.2Se_0.15Te_2.85 during service. The result shows that with the increasing aging time, Ni layer was constantly consumed by SAC305 and Bi₂Te₃-based thermoelectric materials simultaneously. The reaction products are (Cu,Ni)₆Sn₅ and NiTe or Ni(Bi,Te), respectively. Besides, the shear strength of SAC305/Bi_0.5Sb_1.5Te₃ joint or SAC305/Bi_1.8Sb_0.2Se_0.15Te_2.85 joint gets gradually decreased and thermoelectric conversion performance gets worse. Meantime, the different failure mechanisms are also compared between SAC305/Bi_0.5Sb_1.5Te₃ couple joints and SAC305/Bi_1.8Sb_0.2Se_0.15Te_2.85 couple joints.

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Title: Interfacial Reaction and Shear Strength of SnAgCu/Ni/Bi2Te3-Based TE Materials During Aging
Authors: Hongyang Jing
Yuan Li
Lianyong Xu
Yongdian Han
Guoquan Lu
Hao Zhang
Publication date: 01-12-2015
Publisher: Springer US
Published in: Journal of Materials Engineering and Performance / Issue 12/2015
Print ISSN: 1059-9495
Electronic ISSN: 1544-1024
DOI: https://doi.org/10.1007/s11665-015-1809-2

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