International conference on wafer bonding for MEMS technologies and wafer level integration

Excerpt

WaferBond’15, the international conference on Wafer bonding for MEMS technologies and wafer level integration took place in Braunschweig, Germany organized by an international Organizing Committee and hosted by Fraunhofer IST, the Technical University of Braunschweig-Institute for Surface technologies (IOT) and INPLAS Network of competences 7th–9th December 2015. It was the seventh event in a row and attracted almost 100 researchers from science and industry. The attendees came from over 12 countries worldwide, e.g. USA, Japan, China, and European countries. From 43 contributions 29 oral presentations and 19 posters were shown. Every session was introduced by an excellent keynote presentation, held by experts on the field of wafer bonding. The presentations and posters covered the following issues: direct silicon bonding at low and high temperatures, metal to metal thermo-compressive bonding (with and without solder), glass frit bonding or adhesive bonding and issues like integration of wafer bonding into industrial fabrication processes for MEMS, reliability tests, 3D-Integration, wafer bonding equipment, markets and trends. …