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2013 | OriginalPaper | Chapter

1. Introduction

Authors : Joäo M. P. Q. Delgado, Eva Barreira, Nuno M. M. Ramos, Vasco Peixoto de Freitas

Published in: Hygrothermal Numerical Simulation Tools Applied to Building Physics

Publisher: Springer Berlin Heidelberg

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Abstract

Building pathologies originated by moisture are frequently responsible for the degradation of building components and can affect users’ health and comfort. The solutions for treating moisture related pathologies are complex and, many times, of difficult implementation. Several of these pathologies are due to innovative techniques combined with new materials of poorly predicted performance. The knowledge of the physical processes that define hygrothermal behaviour allows for the prediction of a building response to climatic solicitation and for the selection of envelope solutions that will lead to required feasibility.

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Literature
go back to reference Burch DM (1995) An analysis of moisture accumulation in the roof cavities of manufactured housing. In: Airflow performance of building envelopes, components, and systems, ASTM STP 1255, American Society of Testing and Materials, Philadelphia, USA, pp 156–177 Burch DM (1995) An analysis of moisture accumulation in the roof cavities of manufactured housing. In: Airflow performance of building envelopes, components, and systems, ASTM STP 1255, American Society of Testing and Materials, Philadelphia, USA, pp 156–177
go back to reference Straube J, Burnett EFP (1991) Overview of hygrothermal (HAM) analysis methods. In: Trechsel HR (ed) ASTM manual 40-moisture analysis and condensation control in building envelopes, ASTM international, Philadelphia, USA Straube J, Burnett EFP (1991) Overview of hygrothermal (HAM) analysis methods. In: Trechsel HR (ed) ASTM manual 40-moisture analysis and condensation control in building envelopes, ASTM international, Philadelphia, USA
Metadata
Title
Introduction
Authors
Joäo M. P. Q. Delgado
Eva Barreira
Nuno M. M. Ramos
Vasco Peixoto de Freitas
Copyright Year
2013
Publisher
Springer Berlin Heidelberg
DOI
https://doi.org/10.1007/978-3-642-35003-0_1