Skip to main content
Top

Investigation of dielectric relaxation and ac conductivity in Au/(carbon nanosheet-PVP composite)/n-Si capacitors using impedance measurements

  • 01-04-2023
Published in:

Activate our intelligent search to find suitable subject content or patents.

search-config
loading …

Abstract

The study focuses on the investigation of dielectric relaxation and ac conductivity in Au/(carbon nanosheet-PVP composite)/n-Si capacitors using impedance measurements. The authors aim to enhance the performance of metal-insulator-semiconductor (MIS) and metal-polymer-semiconductor (MPS) capacitors by introducing a carbon nanosheet-PVP composite organic interlayer. The research demonstrates that the dielectric properties and ac conductivity of these capacitors are strongly influenced by frequency and voltage, particularly at low and intermediate frequencies. The findings highlight the importance of interface traps and Maxwell-Wagner-type polarization in understanding the dielectric behavior of these structures. The use of carbon nanosheet-PVP composites shows promise in improving the energy storage capacity and overall performance of capacitors, making this article a valuable resource for professionals in the field of materials science and electrical engineering.

Not a customer yet? Then find out more about our access models now:

Individual Access

Start your personal individual access now. Get instant access to more than 164,000 books and 540 journals – including PDF downloads and new releases.

Starting from 54,00 € per month!    

Get access

Access for Businesses

Utilise Springer Professional in your company and provide your employees with sound specialist knowledge. Request information about corporate access now.

Find out how Springer Professional can uplift your work!

Contact us now
Title
Investigation of dielectric relaxation and ac conductivity in Au/(carbon nanosheet-PVP composite)/n-Si capacitors using impedance measurements
Authors
Yasemin Şafak Asar
Ömer Sevgili
Şemsettin Altındal
Publication date
01-04-2023
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 10/2023
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-023-10320-1
This content is only visible if you are logged in and have the appropriate permissions.