Issue 1/2001
Content (10 Articles)
Regular Issue Paper
Deposition of polycrystalline AIN thin films by coherent magnetron sputtering at temperatures <80°C
A. K. Chu, C. H. Chao, F. Z. Lee, H. L. Huang
Regular Issue Paper
Up-conversion luminescence of erbium (III) oxalate nanoparticles/titania/ÿ-glycidoxypropyltrimethoxysilane composite sol-gel thin films
Wenxiu Que, Y. Zhou, Y.L. Lam, Y. C. Chan, C. H. Kam, L. H. Gan, G. Roshan Deen
Regular Issue Paper
Simulation of microstructural evolution induced by scanned laser annealing of metallic interconnects
C. S. Hau-Riege, S. P. Hau-Riege, C. V. Thompson
Regular Issue Paper
Solid phase reaction of Ti with Si−Ge layers prepared by Ge-implantation
B. Umapathi, S. Das, S. K. Lahiri, S. Kal
Regular Issue Paper
Properties of GaN epitaxial layers grown at high growth rates by metalorganic chemical vapor deposition
Y. Kokubun, J. Nishio, M. Abe, T. Ehara, S. Nakagomi
Regular Issue Paper
The effects of process conditions and substrate on copper MOCVD using liquid injection of (hfac)Cu(vtmos)
Chi-Hoon Jun, Youn Tae Kim
Regular Issue Paper
Use of multicomponent phase diagrams for predicting phase evolution in solder/conductor systems
K. Zeng, J. K. Kivilahti
Regular Issue Paper
The effect of Pb contamination on the solidification behavior of Sn-Bi solders
Kil-Won Moon, William J. Boettinger, Ursula R. Kattner, Carol A. Handwerker, Doh-Jae Lee
Regular Issue Paper
Effects of impurities on removal of polysilicon in chemical-mechanical polish
Don-Gey Liu, Ming Shih Tsai, Wen Luh Yang, Chih-Yuan Cheng
Regular Issue Paper
High conductivity copper-boron alloys obtained by low temperature annealing
S.-L. Zhang, J. M. E. Harper, F. M. D'Heurle