Issue 1/2012
Phase Stability, Phase Transformation and Reactive Phase Formation in Electronic Materials
Content (20 Articles)
Influence of Pd Concentration on the Interfacial Reaction and Mechanical Reliability of the Ni/Sn-Ag-Cu-xPd System
C. E. Ho, L. H. Hsu, S. W. Lin, M. A. Rahman
Solid–Solid Reaction Between Sn-3Ag-0.5Cu Alloy and Au/Pd(P)/Ni(P) Metallization Pad with Various Pd(P) Thicknesses
C. E. Ho, W. H. Wu, L. H. Hsu, C. S. Lin
Phase Equilibria of the Sn-Bi-Te Ternary System
Chen-nan Chiu, Chia-ming Hsu, Sinn-wen Chen, Hsin-jay Wu
Kinetics of Solid-State Reactive Diffusion in the (Pd-Ni)/Sn System
M. Hashiba, W. Shinmei, M. Kajihara
Fast Concurrent Growth of Ni3Sn4 and Voids During Solid-State Reaction Between Sn-Rich Solder and Ni Substrates
Bo-Mook Chung, Jaeho Choi, Joo-Youl Huh
Optical Properties and Durability of Al2O3-NiP/Al Solar Absorbers Prepared by Electroless Nickel Composite Plating
T. K. Tsai, S. J. Hsueh, J. H. Lee, J. S. Fang
A Study on Sputtered Bi-Te Thermoelectric Films with Various Compositions: Microstructure Evolution and the Effects on Thermoelectric and Electrical Properties
Minsub Oh, Seong-jae Jeon, Haseok Jeon, Seungmin Hyun, Hoo-jeong Lee
The Effect of Sb Addition on Sn-Based Alloys for High-Temperature Lead-Free Solders: an Investigation of the Ag-Sb-Sn System
D. Li, S. Delsante, A. Watson, G. Borzone
A Study on the Breakdown Mechanism of an Electroless-Plated Ni(P) Diffusion Barrier for Cu/Sn/Cu 3D Interconnect Bonding Structures
Byunghoon Lee, Haseok Jeon, Seong-Jae Jeon, Kee-Won Kwon, Hoo-Jeong Lee
A Simple Process for Synthesis of Ag Nanoparticles and Sintering of Conductive Ink for Use in Printed Electronics
Inyu Jung, Yun Hwan Jo, Inyoung Kim, Hyuck Mo Lee
The Transparent Conductive Properties of Manganese-Doped Zinc Oxide Films Deposited by Chemical Bath Deposition
J.S. Fang, W.H. Luo, C.H. Hsu, J.C. Yang, T.K. Tsai
Cross-Interaction Study of Cu/Sn/Pd and Ni/Sn/Pd Sandwich Solder Joint Structures
C. T. Lu, T.S. Huang, C.H. Cheng, H.W. Tseng, C.Y. Liu
Low-Resistivity Ru-Ta-C Barriers for Cu Interconnects
J.S. Fang, J.H. Lin, B.Y. Chen, G.S. Chen, T.S. Chin
Interfacial Reactions in Sn/Fe-xNi Couples
Yee-Wen Yen, Hsien-Ming Hsiao, Shih-Wei Lin, Pin-Ju Huang, Chiapyng Lee
Evaluation of Diffusion Barrier Between Lead-Free Solder Systems and Thermoelectric Materials
T.Y. Lin, C.N. Liao, Albert T. Wu
Elucidating the Metal-Induced Crystallization and Diffusion Behavior of Al/a-Ge Thin Films
Chao-Nan Yeh, Kewin Yang, Hsin-Yi Lee, Albert T. Wu
Conductor Formation Through Phase Transformation in Ti-Oxide Thin Films
Y. S. Liu, Y. H. Lin, Y. S. Wei, C. Y. Liu
Ni Interdiffusion Coefficient and Activation Energy in Cu6Sn5
Kuan-Chih Huang, Fuh-Sheng Shieu, Y. H. Hsiao, C. Y. Liu