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Journal of Electronic Materials

Issue 10/2001

Content (17 Articles)

Regular Issue Paper

Alternatives for joining Si wafers to strain-accommodating Cu for high-power electronics

Nicholas Faust, Robert W. Messler, Subhash Khatri

Regular Issue Paper

Electromagnetic shielding of nylon-66 composites applied to laser modules

W. S. Jou, T. L. Wu, S. K. Chiu, W. H. Cheng

Regular Issue Paper

Effect of ion beam irradiation on metal silicon junctions

G. S. Virdi, Jagat Singh, D. Kabiraj, D. K. Avasthi, P. J. George, N. Nath

Regular Issue Paper

Unintentional incorporation of B, As, and O impurities in GaN grown by molecular beam epitaxy

Hyonju Kim, Fredrik J. Fälth, Thorvald G. Andersson

Regular Issue Paper

Structural and optical investigation of InGaN/GaN multiple quantum well structures with various indium compositions

Hyung Koun Cho, Jeong Yong Lee, Chi Sun Kim, Gye Mo Yang

Regular Issue Paper

Observations of deep levels in 4H-SiC using optoelectronic modulation spectroscopy

Chi-Hsin Chiu, P. J. M. Parmiter, K. Hilton, M. J. Uren, J. G. Swanson